http://www.reportlinker.com/p092531/World-System-on-a-Chip-Market.html

This report analyzes the worldwide markets for System-On-A-Chip (SOC) in US$ Million.The specific end-use segments analyzed are Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The major types of SOCs also analyzed are SoCs Based on Standard Cell, and SoCs Based on Embedded IP.The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2004 through 2015. The report profiles 189 companies including many key and niche players worldwide such as Actel Corporation, Altera Corporation, ARC International, ARM Holdings, Broadcom Corporation, Core Logic, Freescale Semiconductor, GCT Semiconductor Inc., Infineon Technologies, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Matsushita Electric Industrial Co., Ltd, Mentor Graphics Corporation, NEC Electronics Corporation, NVIDIA Corporation, ON Semiconductors Corporation, Palmchip Corporation, Provigent, Inc., Renesas Technology Corp., Samsung Electronics Co., Ltd., STMicroelectronics N.V, Synopsys Inc., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments, Toshiba America Electronics Components, Xilinx, Inc., Zilog Inc., and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

SYSTEM-ON-A-CHIP (SoC) MCP-1471
A GLOBAL STRATEGIC BUSINESS REPORT
CONTENTS
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-2
Quantitative Techniques & Analytics I-3
Product Definitions and Scope of Study I-3
II. EXECUTIVE SUMMARY
1. Market Highlights II-1
2. System-On-A-Chip: A Major Breakthrough in Semiconductor Industry II-2
Global System-on-a-Chip Market II-2
SoCs Grow at the Expense of Standalone Chips II-2
North America Dominates, Asia-Pacific Witnesses Fastest Growth II-3
Table 1: Global SoCs Market by Geographic Region/ Country:
Percentage Share Breakdown for US, Canada, Japan, Europe,
Asia-Pacific (Excluding Japan) and Rest of World for 2007 &
2010(includes corresponding Graph/Chart) II-3
Table 2: Global SoCs Market: Geographic Region/Country Ranked
by Growth for US, Canada, Japan, Europe, Asia-Pacific
(Excluding Japan), and Rest of World (includes corresponding
Graph/Chart) II-4
SoCs Based on Embedded IP Steals the Limelight II-4
SoCs Based on Standard Cells Grows with Moderate Rate II-4
Table 3: Global SoCs Market by Product Type: Percentage
Share Breakdown for SoCs Based on Standard Cell, and SoCs
Based on Embedded IPs for 2007 & 2010 II-4
Table 4: Global SoCs Market: Product Types Ranked by Growth
for SoCs Based on Embedded IP, and SoCs Based on Standard
Cell II-5
Computers and Communications Lead End-use Category II-5
Table 5: Global SoCs Market by End-use Application:
Percentage Share Breakdown for Computers, Communication
Equipment, Consumer Electronics Devices, Automotive
Applications and Others for 2007 & 2010 (includes
corresponding Graph/Chart) II-6
Table 6: Global SoCs Market: End-Use Applications Ranked by
Growth for Consumer Electronics Devices, Automotive
Applications, Computers, Communication Equipment and Others
(includes corresponding Graph/Chart) II-6
Consumer Electronics Products on a High Growth Track II-7
Increasing Usage of SoC Solutions in Medical Field II-7
3. Progression of the SoC Market II-8
4. Factors Driving S-o-C Market II-9
Increasing Need for Compactness and High Speed II-9
New End-Use Devices Spark Up SoCs Market II-9
Innovations Drive Growth II-9
Growing Demand for 90-nm Technology II-10
Customization to Meet Client's Requirements II-10
Advent of Three-Dimensional Chips II-10
SoC IP Designs Witness Rising Demand II-11
5. Competitive Overview II-12
Leading Players in the SoC Market II-12
Players in Hard Disk Drive SoCs Market - A Recent Past
Perspective II-12
Table 7: Global Hard Disk Drives (HDD) SoCs Market: (2005):
Percentage Share Breakdown by Company for Agere, Marvell and
STMicroelectronics (includes corresponding Graph/Chart) II-12
6. Industry Challenges II-13
High Costs, a Major Deterrent II-13
Time-to-Market Pressures II-13
Verification Challenges II-14
Testers - A Solution to the Challenge II-14
IP Compatibility Issue II-15
Issues Related to Marketing of ICs II-15
Customer & Software Support and Staffing Challenges II-16
7. Market Trends & Issues II-17
Embedded Software to Power System-on-a-Chip (SoC) Solutions II-17
Advanced ESL Design-For-Verification Solution to Reduce
Verification Time for Complex SoCs II-17
Dual-Core Processors Gain Ground II-17
ASIC Designs for Supersystems Make a Foray II-18
Development of IP Market II-18
Emergence of System-above-Chip (SaC) Market II-19
Advent of Lab-on-a-Chip (LoC) Technology II-19
Standardization to Drive the Market II-19
SoCs Surpasses Standalone Chip in Terms of Price II-20
Development of Reusable IPs II-20
Innovations Address Power Leakage and Multiple Tasks Handling II-20
Consolidation Fuels Growth II-21
Growth in the Semiconductor Manufacturing Equipment Sector II-21
Multi-Tasking Microprocessors Gain Significance II-21
EDA and Silicon Intellectual-Property (IP), Two Burgeoning
Sectors II-21
PLD Market Demand - A Recent Past Perspective II-22
Table 8: Global Programmable Logic Device (PLD) Market:
(2005): Percentage Share Breakdown by Company for Xilinx,
Altera and Others (includes corresponding Graph/Chart) II-22
Customizable Analog IPs Add New Dimension to Complex SoCs II-22
FPGA Makes Inroads in the Semiconductor Chips Market II-22
Development of Premanufactured ASICs, and Flash- and SRAM-
Series of FPGAs II-23
Innovative Design Configuration of FPGAs II-23
Emergence of Three-Tier Design Approach of FPGA-Based Chips II-23
Evolution of System-On-A-Programmable Chip (SOPC) II-23
Wide Application of SoCs in Mobile Phones and Broadband Networks II-24
Standard Logic and Interface Equipment Prevails II-24
Compact Size of Logic Devices Favors Growth II-24
8. Product Overview II-26
SoC - Emerging Technology in the Global Semiconductor Industry II-26
Components of SoC II-26
System-on-a-Chip (SoC) Block Diagram II-26
SoC Design Benefits II-26
"Second-Generation" SoCs II-27
ASIC SSOC - A New Dimension II-27
SoC Device Types II-27
Standard Cells II-27
Embedded IP II-27
Micro Logic IP II-28
Memory IP II-28
ASIC/PLD IP II-28
Analog IP & Other Components II-28
Standards for SoCs II-28
SoC Processor Types II-29
Soft Instruction Processors II-29
Configurable Processors II-29
Total Design Strategies for SoCs II-29
Architecture Strategy II-29
Design-for-Test Strategy II-30
Validation Strategy II-30
Synthesis and Back-End Strategy II-30
Integration Strategy II-30
9. SoC End-Use Applications II-31
Computers II-31
Communications Equipment II-31
Consumer Electronics Devices II-31
Automotive Applications II-31
Others II-32
Industrial Automation & Military II-32
Medical & Office Devices II-32
CRM and Hearing Aid Products Dominate the Category II-32
New Mixed-Signal Radio-Frequency (RF) Technology Design II-32
SoC-Equipped Nanorobots II-33
10. SoC Intellectual Property (IP) II-34
Interconnect - A Growing Sector of Semiconductor IP Market II-34
11. System-in-Package (SIP): A Potential Threat to System-on-a-Chip II-35
SiP Market II-35
12. Semiconductor Industry Overview II-36
Global Semiconductor Industry - Witnessing Rapid Growth II-36
The Moore's Law Gives Rise to Sophisticated, Faster and
Cheaper Chips II-36
Technology Advancements Provide Necessary Impetus II-36
Semiconductor Industry by Geographic Markets II-36
Asia and the US - Two Major Semiconductors Market II-36
Leading Semiconductor Players - A Recent Past Perspective II-37
Table 9: Global Semiconductors Market by Leading Players
(2005): Market Share Breakdown by Company for Intel,
Samsung, Renesas, Texas Instruments, Toshiba,
STMicroelectronics and Others (includes corresponding
Graph/Chart) II-37
Semiconductors Market by End-Use Sectors - A Recent Past
Perspective II-38
Table 10: Global Semiconductors Market (2005): Percentage
Share Breakdown by End-Use Sector for EDP, Telecom,
Industrial, Automotive, Consumer and Military & Others
(includes corresponding Graph/Chart) II-38
Integrated Circuits and Fabless Market - A Recent Past
Perspective II-38
IC Market II-38
Table 11: Global Market for IC Design Houses Using Foundry
Services (2005): Percentage Share Breakdown by Region for
South Korea, Japan, China, Taiwan and Rest of World
(includes corresponding Graph/Chart) II-38
Fabless Market II-39
Table 12: Global Fabless Market (2005): Percentage Share
Breakdown by Region for North America, Asia Pacific, Europe
and Rest of World (includes corresponding Graph/Chart) II-39
Table 13: Global Fabless Market (2005): Percentage Share
Breakdown by Company for Qualcomm, Broadcom, NVidia, ATI,
SanDisk, Agilent Xilinx, Marvell, MediaTek, Altera and
Others (includes corresponding Graph/Chart) II-39
MEMS Market II-40
Table 14: Global Micro-Electromechanical Systems (MEMS)
Market (2005): Percentage Share Breakdown by Product Type
for Actuators and Sensors II-40
13. SoC Technological Developments by Select Market Players II-41System-on-a-Chip (SoC) for Printers II-41
W-OFDM-SoCs II-41
Xilinx(R) Virtex(TM) FPGAs and Embedded Solutions II-41
EPON-Based System-on-a-Chip (SoC) II-42
RapidChip(R) SoC Prototyping Platform II-42
Analog Devices Othello-E Transceiver II-42
True System-on-a-Chip (SoC) II-42
14. Product Developments & Launches II-43
Broadcom Unveils Advanced Encoder/Transcoder SoC Solution II-43
Broadcom Showcases High Definition Set-Top Box System-on-a-Chip II-43
Broadcom Unveils a Single Chip DBS Set-Top-Box Solution II-43
GCT Semiconductor Unveils SoC Solution Supporting WiMAX and
WiFi Functionality II-43
Infineon Releases CAT-iq(TM) Wireless Engine II-43
Broadcom Showcases a Whole New Range of SoC Solutions for
Mobile Devices II-44
NVIDIA Introduces an Innovative Applications Processor II-44
Samsung Introduces Single-Chip Decoder II-44
Toshiba Introduces SoC Solution for ATSC LCD HDTVs II-44
Broadcom Uncovers Reference Design Platform for HD Optical
Disc Players II-44
Broadcom Introduces Digital-to-Analog Adapter II-45
STMicroelectronics Introduces 'ST21NFCA' - SoC Solution for
the NFC Market II-45
Broadcom Unveils SoC Solutions for the Mobile TV Market II-45
New Series of IC Tuners from Infineon II-45
TI Integrates Bluetooth(R), FM and GPS Technologies on to a
Single Chip II-45
STMicroelectronics Releases Bluetooth(R) and FM-Radio SoC Solution II-45
Upgraded Version of 90-Namnometer Reference Flow from SMIC
and Synopsys II-46
Syntax-Brillian Opts Digital TV SoC Solution from Broadcom II-46
Broadcom Showcases BCM7400B SoC II-46
Marvell Introduces Bluetooth Single-Chip Solution II-46
D2 Technologies Unveils Embedded VoIP Software II-46
Broadcom Rolls Out the New BCM4325 Single-Chip II-47
Westinghouse Digital Selects BCM3560 SoC Solution II-47
Broadcom Releases the BCM7118 Single Chip II-47
Infineon Launches 3G ADSL2+ SoC II-47
ARC International Launches New VRaptor(TM) Media Architecture II-47
MOSAID Rolls Out Memorize(TM) and Fractional-N PLL II-48
Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers II-48
Alvand Technologies Unveils SoC Humming-B(TM) Family of Tuners II-48
MagnaChip Releases MC531EA SoC Imaging Solution II-48
Genesis Microchip Unveils the Chaplin DTV family of ICs II-48
PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design
Solution II-48
STMicroelectronics Unleashes the SPEAr Head600 and SPEAr
Plus600 ICs II-49
CAST, Inc. Rolls Out the SOC Kernels II-49
ARM and Northwest Logic's PCI-SIG-compliant solution II-49
Cypress Releases The PSoC Express 2.1 II-49
Texas Instruments Unveils Single-Chip NaviLink(TM) 5.0 Solution II-49
Sonics Launches New Version of SonicsMX(R) SMART Interconnect(TM)
Solution II-50
SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip II-50
Broadcom Launches BCM7440 Blu-ray/HD DVD SoC Solution II-50
Freescale Launches PowerQUICC(TM) III Processor Line II-50
Freescale Introduces Multicore MPC8572 Family II-50
Freescale Unveils the MPC8323E Processor II-51
GCT Semiconductor Releases Monlothic Single Chip II-51
National Semiconductor and ARM Launch PWI 2.0 Specification II-51
NEC Electronics Rolls Out UX7LSeD Technology II-51
NEC Electronics Launches MP201 Single-Chip Application Processor II-51
NEC Electronics Introduces 55nm Standard CMOS Process Technology II-51
National Semiconductor LM5071 Single Chip Solution II-52
Synopsys Unveils DesignWare(R) Mobile Storage II-52
Denali's Databahn(TM) Product Released for NAND Flash Memory Devices II-52
Pixelplus Unleashes PM1001 and PO4030 SoC Solutions II-52
Adventiq's Launches KVM System-On-A-Chip Product II-52
Semtech Corporation Rolls Out SX8801R SoC for Data Acquisition II-53
Key ASIC Unleashes the KeySoC(TM) Platform II-53
Summit Unleashes the Panorama(TM) in Three Configurations II-53
Micronas Unveils a New Audio SoC Solution for TV - Manufacturers II-53
LTRIM Technologies Launches Latest Genre of DC-DC Converter IP
Blocks II-54
Silistix's New Chip Area Interconnection (CHAIN) Scheme II-54
SigmaTel Unleashes the STDC3000 SoC Controller Solution II-54
Chipcon Releases the 'CC1110' SoC Solution for Wireless
Payment Systems II-54
Atmel(R) Corporation Launches its All-Format DVD SoC II-55
Pixelplus Releases the 1.3 Megapixel Image Sensor PO5130 SoC II-55
Broadcom Introduces SoC Power Management Unit II-55
FMA Launches the Mobile WiMAX System-on- Chip (SoC) Solution II-55
DSP Group Unveils A New System-on-a-Chip Solution II-55
IP Cores Introduces Two Advanced Encryption Standard (AES)
Based Security IP Cores II-56
PMC-Sierra Unveils Multi-Service MIPS-based Processor SoC
Solution II-56
Conexant Releases ADSL2plus Central Office SoC Solution II-56
TI Releases VoIP System-on-a-Chip Solution II-56
Zoran Unveils System-on-Chip Approach 5 family of Processors II-56
DAFCA Releases ClearBlue(TM) version 2006.1 Product Suite II-57
TEK Microsystems and QinetiQ RTES Jointly Develop the
JazzStore SoC(TM) II-57
LG to Design SoCs by Employing Apache's RedHawk-EV Solution II-57
Faraday Unveiled the FIE7010- an MP3 Player SoC Platform II-57
Pixelplus Releases Second Generation of SoC Image Sensors II-57
PMC-Sierra Launches the PM5336 ARROW 2488 II-58
Provigent Introduces Development Kit for Wireless PTP Systems II-58
Renesas Unveils Transistor Technology Using Hybrid CMIS
Transistors II-58
Renesas Unleashes the "SH7774" SoC Solution for Car Navigation
Devices II-58
Renesas Introduces Chip-on-Chip Technology II-58
S2C Releases Two Models of Rapid FPGA Prototyping Solution Series II-59
Samsung Electronics Unveils System-on-Chip Solution for Hybrid
Drive II-59
STMicroelectronics Introduces the T90 System-on- Chip (SoC)
Solution II-59
Synopsys Develops PCI Express to AMBA 2.0 AHB DesignWare(R) Bridge II-59
Toshiba Introduces Second Generation of TC904XX Family of SoCs II-59
Toshiba Unveils 2.0 Megapixel and 3.2 Megapixel CMOS SoC Image
Sensors II-60
Hua Hong NEC and Synopsys Unveil their Reference Design Flow 2.0 II-60
Sonics Inc., Unveils SonicsMX SMART Interconnects Solution II-60
Sonics White Paper Defining SoC Interconnect Options for
Developers II-60
Sonics Introduces the SonicsLX SMART Interconnect Solution II-60
Actel Introduces Design Infrastructure for ARM7-Enabled Fusion
Programmable System Chips II-61
Actel Unveils the CoreMP7 Development Kit for ARM7-Enabled
CoreMP7 Soft Processor Core II-61
Cypress Semiconductor Launches New Evaluation Kit for Wireless
Radio System-on-a-Chip (SoC) II-61
Pentax Introduces Optio A10 Image Stabilization System Using
Cypress' PsoC II-61
Hynix and M-Systems Introduces DOC Embedded Flash Drive (EFD) II-61
Sonics Unveils a New S3220 SMART Interconnects Solution II-61
Atmel Unveils New SoC Solution II-62
Agere Systems Develops USB 2.0 SoC II-62
Sunplus Unveils SPG290, a High-Performance System-on-a-Chip (SoC) II-62
Renesas Introduces Two Single-Chip ICs II-62
Renesas Unveils SH7397 32-Bit Microprocessor as a Single Chip
Solution II-62
STMicroelectronics Releases 90nm HDD SoC devices II-63
Zoran Launches APPROACH 5, SoC for Mobile Handsets II-63
SigmaTel Unveils New SoC Solution for Multi-Function Printers II-63
CEVA Introduces a New DSP Architecture, the CEVA-X1621(TM) II-63
Conexant Systems Unveils Integrated Xenon SoC Solution II-63
K-Micro Releases Topaz Computing Subsystem for SoCs II-64
Samsung Electronics Introduces 90-nm SoCs for Mobile Applications II-64
Magma and ARM Unveils an Advanced Implementation Solution for
SoC Designs II-64
Parama Networks Unveils Transport SoC Technology II-64
Renesas Develops Advanced TTRAM for High-Speed and Low Power
Consuming Applications II-64
Renesas Introduces Automated Device Sizing System for Use in SoCs II-65
S2C Releases New Interconnect Technology for SoC Designs II-65
PortalPlayer Introduces Two New Audio SoCs II-65
LSI Logic Corporation Innovates RapidChip SoC Prototyping
Platform II-65
PRO/Wireless 5116 SoC from Intel II-65
New SoC Solution from Micronas II-65
Chipcon Innovates CC2431 ZigBee(TM) SoC Solution II-66
Ziptronix Develops Three-Dimensional System-on-a-Chip Device II-66
1st Silicon and ZFOUNDRY Develops A18 Technology II-66
Chipcon Unveils CC2430 ZigBee SoC Solution II-66
Cypress Unveils 1.3-Megapixel SoC and Image Sensor Solutions II-66
Marvell Unveils VoWLAN SoC Solutions II-67
Micron Technology Unveils New SoC Sensor II-67
Mindspeed Technologies Introduces SoC Solution II-67
BroadLight Unveils BL2000 SoC II-67
STMicroelectronics Innovates SoC IC Devices II-68
RF Micro Devices Releases SiW4000 Bluetooth SoC Solution II-68
Vitesse Unveils Ethernet Switch System-on-a-Chip Solutions II-68
Cypress Develops Programmable System-on-a-Chip, CY8C24794-24LFXI II-69
Cypress Launches Programmable SoC, CY8C21x23 II-69
FS2 System Navigator from First Silicon Solutions II-69
AMI Semiconductor Enhances its SmartPower SoC Mixed-Signal IC
Technology II-69
AMI Semiconductor Develops Miniature Single-Chip Stepper Motor
Driver-Controller ICs II-69
Atheros Develops Integrated Single-Chip 802.11g Access Point
Solution II-70
Matsushita (Panasonic) Develops HD-PLC Technology for Home
Networking Applications II-70
AXIOM Introduces MPSim(TM) System Verilog Verification II-70
Provigent Launches PVG310 Single-Chip Modem II-70
QUALCOMM and TSMC Jointly Develops 90-nm MSM(TM) Solutions II-70
Renesas Offers Embedded DRAM Core for SoCs II-71
RF Micro Unveils SiW4000(TM) SoC Bluetooth(R) Solution II-71
Samsung Develops ViP Design Methodology for Significantly
Reducing SoC Design Time II-71
QuickLogic Corporation Introduces New Programmable SoC Devices II-71
New Solution for ESL Designs II-71
Vitesse Develops Gigabit Ethernet Switches II-71
Passave Develops SoC for EPON II-72
Enpirion Unveils Power SoC Solution II-72
CEVA Unveils Xpert-Palm II-72
Agilent Offers SoC Solution for PDAs II-72
Advantest Develops New T2000 MS Mainframe for Mid-Range SoCDevices II-72
Advantest Introduces T6577 SoC Test System II-73
15. Recent Industry Activity II-74
ON Semiconductor Acquires AMI Semiconductor II-74
Broadcom Takes Over Sunext Design II-74
Broadcom Collaborates with Microsoft II-74
Broadcom Along with Coship Provides HD Set-Top Box Solution
in China II-74
Zilog Signs Distribution Agreement with Nu Horizons II-74
BroadLight partners with ITRI II-75
ARC Extends Collaboration Agreement with Toshiba II-75
Samsung Uses Integrated FM Radio and Bluetooth(R) SoC from
Broadcom II-75
NEC Opts Wipro to Provide Semiconductor Design Solutions II-75
Axiom Invests US$3 Million for New R&D Center in India II-75
Matsushita Implements IC Compiler of Synopsys II-75
EtherWaves Acquires Sonarics II-76
Silicon Image Acquires sci-worx II-76
Cortina Systems Acquires ImmenStar II-76
Wipro Acquires OTCS II-76
Synopsys Acquires MOSAID IP Assets II-76
BroadLight Collaborates with OpenCon Systems II-76
Mindspeed Partners with Terawave II-76
IC Nexus Partners with HDL Design House II-77
Global Unichip Allies with Vivante Graphics II-77
Jazz and Fujitsu Join Forces II-77
Coronis Systems Partners with Essensium N.V. II-77
Global Unichip Opts Testing Solution from Synopsys II-77
Core Logic to Establish Solution Center in China II-78
Newark Signs Franchise Agreement with Cypress II-78
Silicon Image Signs an Accord with Sunplus II-78
ARC Signs Multiple Agreements II-78
Global IP Sound Changes to Global IP Solutions II-78
Faraday Forms an Alliance with Palmchip Corporation II-78
CAST Enters into a Distribution Agreement with S2C II-78
Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee(R)
Chipset by 2008 II-79
Renesas Enters into an Agreement with Key Stream Corporation II-79
Renesas and Matsushita into their Fifth Stage of Collaboration II-79
Renesas Employs Synopsys' VCS Verification Solution and VMM
Methodology II-79
Renesas Adopts Synopsys' IC Compiler Solution II-79
S2C Inc. is Tensilica(R) Inc.'s New Prototyping Partner in China II-79
Sonics Inc.(R) Enters into an Agreement with Ricoh Company II-80
MoSys Adopts SMIC's CMOS Process Technology II-80
e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors II-80
Haier Group Adopts Broadcom's Digital TV System-on-Chip Solution II-80
AMI Semiconductor Acquires Assets of NanoAmp II-80
AMD Acquires ATI Technologies II-80
LSI Buys Metta Technology II-81
NVIDIA Acquires PortalPlayer II-81
PMC-Sierra Acquires Passave II-81
Broadcom Purchases Sandburst II-81
Texas Instruments Purchases Chipcon AS II-81
Essensium Acquires Mind II-81
inSilicon and Sonics Form an Alliance for Developing Plug-and
-Play SoC Platforms II-82
Sonics and CoWare(R) Enter into a Distribution Agreement II-82
BroadLight Enters into a Contract with Askey Computer II-82
Actions Semiconductor and GMI Sign an Agreement II-82
Mistletoe and eSilicon Develop an Integrated VPN-firewall SoC II-82
Matsushita Collaborates with Renesas to Test 45-nm SoC Technology II-82
Imagination Starts Operations in the US II-82
Air Broadband Selects FMA's WiMAX SoC Solution II-83
ARM Licenses Advantage and Metro Products for 45 nm Technology II-83
QUALCOMM Starts Production of 90nm Chips II-83
eASIC Adds Two European Firms to Support Nextreme Line II-83
Newport Grabs More Funds to Develop SoC Solutions II-83
Sonics Inks an Agreement with CoWare II-83
SMIC and ARC Sign A Joint Agreement II-83
Toshiba Signs an Agreement with ARM II-84
ARCA Licenses ARM926EJ-STM Processor II-84
CMP Licenses ARM(R) RealView(R) ESL Tools II-84
Freescale to License The V2 ColdFire Core II-84
GCT Gets License for ARM926EJ-S(TM) Processor II-84
MIPS and msystems Unite to Develop a Safe-SOC(TM) Security platform II-84
Mobileye Obtains License for MIPS32(R) 34Kf(TM) Core II-85
Extreme DA Collaborates with UMC II-85
Scaleo chip Signs an Agreement with Wipro-NewLogic II-85
Key ASIC Partners with Silterra Malaysia Sdn. Bhd. II-85
STMicroelectronics Partners with iBiquity Digital Corporation II-85
SOCLE Employs UMC's 90nm Process Technology II-85
Wipro Technologies Partners with Tensilica's Processor Core
Design Center II-86
Global Locate Partners with Toshiba to Roll Out Marlin(TM) A-GPS
Chip II-86
Renesas Design Vietnam Opts Synopsys as EDA Provider II-86
CoWare Enters into a Strategic Agreement with Sonics II-86
CoFluent Collaborates with Sonics Inc. II-86
Summit Sells SystemC-based Sonics SMART Interconnects Solutions II-86
Bay Microsystems Acquires Parama Networks II-87
Broadcom Acquires Athena Semiconductors II-87
Cadence Acquires Verisity II-87
MOSAID Takes Over Virtual Silicon II-87
NVIDIA and ARM Enters into a Licensing Agreement II-87
SkyPilot Enters into a Contract Agreement with Fujitsu
Microelectronics for WiMAX SoCs II-88
Virage Logic Enters into an Agreement with UMC II-88
ZAiQ Technologies Teams Up with S2C Inc. II-88
Synopsys Joins Forces with UMC II-88
Marvell Enters into a Deal with UTStarcom II-88
Tensilica Signs an Agreement with EVE II-88
Global UniChip Signs an Agreement with Synopsys II-89
Tower Semiconductor and Cadence Joins Forces II-89
Silterra Teams Up with Essensium II-89
White Electronic Designs Secures Contract for Supply of SoC
Microprocessor Modules II-89
BroadLight Enters into a Licensing Agreement with MIPS
Technologies for MIPS(R) Processor II-89
ARM Acquires Artisan Components II-89
Flextronics Partners with inSilica for the Development of SoC
Solutions II-90
ARM, Artisan Components, NSC, Synopsys and UMC Collaborate for
Advanced SoC Technology II-90
Ansoft Corporation Joins forces with Synopsys, Inc II-90
Nordic Semiconductor Obtains New Components Contract in Europe II-90
16. Related Product/Corporate Developments II-91
Imagination Technologies Unveils New HD Video Decoder Core II-91
Mobileye Selects SMART Interconnect Solution of Sonics II-91
Cypress Semiconductor Introduces CY3630 Evaluation Kit for its
Wireless Radio SoCs II-91
Renesas Technology Unveils Twin-Transistor RAM II-91
New Products from Texas Instruments II-92
K-Micro Develops Topaz Computing Subsystem II-92
New Innovations from AMI Semiconductor II-92
MemMax Memory Scheduler from Sonics, Inc II-92
Sonics Inc. Unveils New Version of SonicsMX SMART Interconnect II-92
SkyPilot Networks Selects SoC Solutions of Fujitsu
Microelectronics II-93
Agere Systems Deploys IC Compiler of Synopsys II-93
Aperto Employs SoC Solutions of Fujitsu II-93
Jazz Semiconductor Unveils Innovative Process Platform for
Advanced RF and Analog SoCs II-93
Telairity Launches Unique Processor Architecture for High
Definition Video II-93
CoWare and Cadence Develop ESL Design Verification Flow II-93
Advantest Unveils Mid-Range SoC Test Solution II-94
Mentor Graphics Introduces Platform Express Product for SPIRIT
1.0 Norms II-94
17. Focus on Select Players II-95
Actel Corporation (US) II-95
Altera Corporation (US) II-95
ARC International (US) II-95
ARM Holdings (UK) II-95
Broadcom Corporation (US) II-96
Core Logic (South Korea) II-96
Freescale Semiconductor (US) II-96
GCT Semiconductor Inc. (US) II-97
Infineon Technologies (Germany) II-97
Intel Corporation (US) II-97
LSI Corporation (US) II-98
Marvell Technology Group Ltd. (US) II-98
Matsushita Electric Industrial Co., Ltd (Panasonic) (Japan) II-99
Mentor Graphics Corporation (US) II-99
NEC Electronics Corporation (Japan) II-100
NVIDIA Corporation (US) II-100
ON Semiconductors Corporation (US) II-100
Palmchip Corporation (US) II-101
Provigent Inc. (US) II-101
Renesas Technology Corp. (Japan) II-102
Samsung Electronics Co., Ltd. (South Korea) II-102
STMicroelectronics N.V. (Switzerland) II-102
Synopsys Inc. (US) II-103
Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) II-103
Texas Instruments (US) II-104
Toshiba America Electronics Components (US) II-104
Xilinx Inc. (US) II-104
Zilog Inc. (US) II-105
Ziptronix, Inc. (US) II-105
18. Global Market Perspective II-106
Table 15: World Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) by Geographic Region/Country - US,
Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest
of World Markets Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2004 through 2010 (includes
corresponding Graph/Chart) II-106
Table 16: World Long-term Projections for System-on-a-Chip
(SoC) by Geographic Region/Country - US, Canada, Japan,
Europe, Asia-Pacific (Excluding Japan) and Rest of World
Markets Independently Analyzed with Annual Sales Figures in
US$ Million for Years 2011 through 2015 (includes
corresponding Graph/Chart) II-107
Table 17: World 10-Year Perspective for System-on-a-Chip (SoC)
by Geographic Region/Country - Percentage Breakdown of Dollar
Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding
Japan) and Rest of World Markets for 2004, 2008 and 2013
(includes corresponding Graph/Chart) II-108
Table 18: World Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) by Product Type - SoCs Based on
Standard Cell and SoCs Based on Embedded IP Markets
Independently Analyzed with Annual Sales Figures in US$
Million for Years 2004 through 2010 (includes corresponding
Graph/Chart) II-109
Table 19: World Long-term Projections for System-on-a-Chip
(SoC) by Product Type - SoCs Based on Standard Cell and SoCs
Based on Embedded IP Markets Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2011 through
2015(includes corresponding Graph/Chart) II-110
Table 20: World 10-Year Perspective for System-on-a-Chip (SoC)
by Product Type - Percentage Breakdown of Dollar Sales for
SoCs Based on Standard Cell and SoCs Based on Embedded IP
Markets for 2004, 2008 and 2013 II-110
Table 21: World Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) by End-Use Application - Computers,
Communications Equipment, Consumer Electronics Devices,Automotive Applications and Other Markets Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2004 through 2010 (includes corresponding Graph/Chart) II-111
Table 22: World Long-term Projections for System-on-a-Chip
(SoC) by End-Use Application - Computers, Communications
Equipment, Consumer Electronics Devices, Automotive
Applications and Other Markets Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2011 through
2015 (includes corresponding Graph/Chart) II-112
Table 23: World 10-Year Perspective for System-on-a-Chip (SoC)
by End-Use Application - Percentage Breakdown of Dollar Sales
for Computers, Communications Equipment, Consumer Electronics
Devices, Automotive Applications and Other Markets for 2004,
2008 and 2013 (includes corresponding Graph/Chart) II-113
III. MARKET
1. North America III-1
Semiconductors Market Perspective III-1
An Overview of the SoC Market III-1
1a. The United States III-2
A.Market Analysis III-2
Rise in SoC End-Use Sectors Drives the Growth III-2
Technological Innovations Adds to Growth III-2
The U.S. Companies Follows Outsourcing Strategy to Reduce Costs III-2
Product Developments & Launches III-2
Strategic Corporate Developments III-26
Related Product/Corporate Developments III-37
Focus on Select Players III-40
Actel Corporation III-40
Altera Corporation III-40
ARC International III-40
ARM-US III-41
Atmel Corporation III-41
AXIOM Design Automation III-41
Broadcom Corporation III-41
Sandburst Corporation III-42
BroadLight, Inc. III-42
Cadence III-42
Conexant Systems, Inc III-42
CPU Technology, Inc III-42
Cypress Semiconductor Corp III-43
Enpirion III-43
Eureka Technology III-43
Freescale Semiconductor III-43
Fujitsu Microelectronics III-44
GCT Semiconductor Inc. III-44
IBM Microelectronics III-44
Intel III-44
LSI Corporation III-45
Marvell Technology Group Ltd. III-46
Magma Design Automation III-46
Mentor Graphics Corporation III-46
Mindspeed Technologies III-47
MIPS Technologies III-47
Motorola III-47
National Semiconductor III-47
NEC Electronics America III-48
NeoMagic Corporation III-48
NVIDIA Corporation III-48
ON Semiconductors Corporation III-48
Palmchip Corporation III-49
Palmchip Semiconductor III-49
Bay Microsystems III-50
PMC-Sierra III-50
Provigent Inc. III-50
QuickLogic Corporation III-50
RF Micro Devices III-51
S2C Inc. III-51
SanDisk Corp. III-51
Sonics, Inc III-52
Synopsys Inc. III-52
Texas Instruments Incorporated III-53
Toshiba America Electronics Components III-53
Wipro Technologies III-53
Xilinx Inc. III-54
Zilog Inc. III-54
Ziptronix, Inc. III-54
B.Market Analytics III-55
Table 24: The US Recent Past, Current & Future Analysis for
System- on-a-Chip (SoC) Market Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2004 through
2010 (includes corresponding Graph/Chart) III-55
Table 25: US Long-term Projections for System-on-a-Chip
(SoC) Market Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2011 through 2015
(includes corresponding Graph/Chart) III-55
1b. Canada III-56
A.Market Analysis III-56
Mosaid Technologies, Inc. - A Major Player III-56
B.Market Analytics III-57
Table 26: The Canadian Recent Past, Current & Future
Analysis for System-on-a-Chip (SoC) Market Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2004 through 2010 (includes corresponding Graph/Chart) III-57
Table 27: Canadian Long-term Projections for
System-on-a-Chip (SoC) Market Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2011 through
2015(includes corresponding Graph/Chart) III-57
2. Japan III-58
A.Market Analysis III-58
An Overview of Japanese Semiconductor Market III-58
Consumer Profile III-58
Foreign Players Ties-Up with Local Fabricators and Vendors III-58
Local Companies Expands Customer Base III-58
SoC Market Overview III-58
Growth in IC Sector III-59
Product Developments & Launches III-59
Strategic Corporate Developments III-61
Related Product/Corporate Developments III-62
Focus on Select Players III-62
Hitachi, Ltd. III-62
Matsushita Electric Industrial Co., Ltd (Panasonic) III-63
NEC Electronics Corporation III-63
Renesas Technology Corp. III-64
B.Market Analytics III-64
Table 28: Japanese Recent Past, Current & Future Analysis
for System-on-a-Chip (SoC) Market Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2004
through 2010 (includes corresponding Graph/Chart) III-64
Table 29: Japanese Long-term Projections for
System-on-a-Chip (SoC) Market Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2011 through
2015 (includes corresponding Graph/Chart) III-65
3. Europe III-66
A.Market Analysis III-66
Semiconductors Market Overview III-66
SoC Market Overview III-66
Semiconductors Market by European Regions - A Recent Past
Perspective III-66
Table 30: Semiconductors Market in Europe (2005 & 2006):
Percentage Share Breakdown by Region/ Country for Germany,
UK, France, Nordic Countries, Italy, Benelux Region and
Rest of Europe (includes corresponding Graph/Chart) III-66
Semiconductors Market by End-Use Sectors - A Recent Past
Perspective III-67
Table 31: Semiconductors Market in Europe (2005):
Percentage Share Breakdown by End-Use Sector for EDP,
Telecom, Automotive, Consumer, Industrial and Military &
Others (includes corresponding Graph/Chart) III-67
Consolidation Drives the Market III-67
Market Trends III-67
SoC Deployment Rises for the Automotive and the
Communications Sector III-67
Demand for Pre-Configured Functional IP Blocks Rising III-68
Subcontracting Increases for Final SoC Products Assembly to
Low- Cost European Countries III-68
Product Developments & Launches III-68
Strategic Corporate Developments III-71
Related Product/Corporate Development III-72
Focus on Select Players III-72
ARM Holdings (UK) III-72
Essensium (Belgium) III-73
Infineon Technologies (Germany) III-73
NEC Electronics (Europe) (Germany) III-73
Nordic Semiconductor (Norway) III-73
OKI Electric Europe (Germany) III-74
Samsung Electronics (UK) III-74
STMicroelectronics N.V. (Switzerland) III-74
B.Market Analytics III-75
Table 32: European Recent Past, Current & Future Analysis
for System-on-a-Chip (SoC) Market Independently Analyzed
with Annual Sales Figures in US$ Million for Years 2004
through 2010 (includes corresponding Graph/Chart) III-75
Table 33: European Long-term Projections for System-on-
a-Chip (SoC) Market Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2011 through 2015
(includes corresponding Graph/Chart) III-75
4. Asia-Pacific III-76
A.Market Analysis III-76
SoC Market Overview III-76
Asia Emerges as a Major Market for SoC Deployment in
Wireless Devices III-76
China III-76
India III-77
From Just Design to Complete Solutions III-77
Challenges Faced III-77
South Korea III-77
Integrated Circuits (ICs) Market - A Recent Past Perspective III-77
Table 34: Integrated Circuits (ICs) Market in Korea
(2005): Percentage Share Breakdown by End-Use Services for
Corporate Management, Design & Development, Engineering
Management, Test Engineering and Others (includes
corresponding Graph/Chart) III-78
Korean SoC Market on a Rise III-78
Product Developments & Launches III-79
Strategic Corporate Developments III-81
Focus on Select Players III-84
X-FAB Sarawak Sdn. Bhd. (Malaysia) III-84
5V Technologies (Taiwan) III-85
Core Logic (South Korea) III-85
Dongbu HiTek Company Ltd. (South Korea) III-85
EE Solutions (Taiwan) III-85
Faraday Technology Corp. (Taiwan) III-85
Global Unichip Corp. (Taiwan) III-86
Hynix Semiconductor (South Korea) III-86
ICNexus (Taiwan) III-86
Insilica Semiconductors (India) III-86
Integrated Circuit Solution (Taiwan) III-87
Samsung Electronics Co., Ltd. (South Korea) III-87
Silicon Motion Technology (Taiwan) III-87
Silterra Malaysia Sdn. Bhd. (Malaysia) III-87
Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) III-88
United Microelectronics Corp. (Taiwan) III-88
B.Market Analytics III-89
Table 35: Asia-Pacific Recent Past, Current & Future
Analysis for System-on-a-Chip (SoC) Market Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2004 through 2010 (includes corresponding Graph/Chart) III-89
Table 36: Asia-Pacific Long-term Projections for
System-on-a-Chip (SoC) Market Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2011 through
2015 (includes corresponding Graph/Chart) III-89
5. Rest of World III-90
Market Analysis III-90
Table 37: Rest of World Recent Past, Current & Future
Analysis for System-on-a-Chip (SoC) Market Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2004 through 2010 (includes corresponding Graph/Chart) III-90
Table 38: Rest of World Long-term Projections for
System-on-a-Chip (SoC) Market Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2011 through
2015 (includes corresponding Graph/Chart) III-90
IV. COMPETITIVE LANDSCAPE

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"Since joining Trident almost two years ago as Senior Vice President of Strategic Marketing, Wen has been instrumental in contributing to our long-term product and market direction. In his new role, Wen will continue to drive the strategic direction of the company as the industry moves toward a connected TV platform, and assume responsibility for Trident's digital TV marketing organization, including product definition and planning," noted Ms. Summers.

"We are also very excited that Saeid has joined the Trident team. Drawing upon his extensive experience, and partnering with our video architecture team, he will be responsible for worldwide hardware and software engineering execution, increasing productivity and improving our SoC design process," stated Ms. Summers.

Executive Biographies

Dr. Li joined Trident in January 2007 as Senior Vice President of Strategic Marketing. Prior to Trident, he was Senior Vice President and Chief Marketing Officer for Huahong International, a company that provided strategic corporate business services including technology acquisition, partnership development and business incubation, serving from 2005 through December 2006. From 2000 to 2005, he was the founder, President and Chief Executive Officer of RedSwitch, a company that provided InfiniBand switches to connect enterprise servers, storage and networking gear. Previously, he served in multiple senior positions at companies such as HAL Computer Systems/Fujitsu, IBM Research Center and RCA. Dr. Li holds a B.S. degree in Electrical Engineering from National Taiwan University and a M.S. degree in Electrical Engineering and Ph.D. degree in Electrical Engineering from the University of Pittsburgh in Pennsylvania.

Mr. Moshkelani, a veteran in semiconductor and systems development, joined Trident on September 2, 2008. Prior to Trident, he served as Vice President of Engineering and Operations for Dust Networks from 2006 to 2008. Mr. Moshkelani also served as Vice President, Engineering and Operations, Consumer Division from 2001-2006 for LSI Logic and Vice President, Engineering and Operations from 1991 to 2001 for C-Cube Microsystems, which was acquired by LSI Logic. From 1997-1998, Mr. Moshkelani held several engineering positions with VLSI Technology, including Director of Design Technology. Mr. Moshkelani began his career at AMI where he served as Design/Product Engineer, Semi-Custom Group from 1984 to 1987. Mr. Moshkelani holds a B.S. degree in Electrical Engineering from Oregon State University.

About Trident Microsystems, Inc.

Trident Microsystems, Inc., with headquarters in Santa Clara, California, designs, develops and markets digital media for the masses in the form of multimedia integrated circuits (ICs) for PCs and digital processing ICs for TVs and TV monitors. Trident's products are sold to a network of OEMs, original design manufacturers and system integrators worldwide. For further information about Trident and its products, please consult the Company's web site: http://www.tridentmicro.com.

NOTE: Trident is a registered trademark of Trident Microsystems, Inc., HiDTV(TM), DPTV(TM), SVP(TM) WX, SVP(TM) UX, SVP(TM) PXP and SVP(TM) CX are trademarks of Trident Microsystems, Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners. Features, pricing, availability and specifications are subject to change without notice.

SOURCE Trident Microsystems, Inc.

http://www.tridentmicro.com