Where: PepCom's Wine, Dine and Demo Event, Manhattan Center -- Hammerstein Ballroom, 311 West 34th Street (between 8th and 9th Avenues), New York, New York 10001

Time: 6:00pm -- 9:00pm

What: Micron will showcase several pico-projectors using its ferroelectric liquid crystal on silicon (FLCOS) microdisplay technology at PepCom's Wine, Dine and Demo media and analyst event. Micron's FLCOS technology offers the most compelling combination of clarity, brightness, and color fidelity for mobile display applications. For media and analysts attending the event, make sure to stop by Micron's table for a chance to win a 3M MPro120 pocket projector.

Relevant Links

There are other ways to stay up-to-date on Micron news:

-- Micron Innovations Blog: www.micronblogs.com

-- Micron on Twitter: http://twitter.com/microntechnews

-- Micron Pressroom: www.micron.com/media

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

SOURCE: Micron Technology, Inc.

Micron Technology, Inc. 
Kirstin Bordner, 208-368-5487 or 208-599-0184 
kbordner@micron.com

Micron Technology, Inc. (NYSE:MU) today announced the company has combined the industry's leading 34-nanometer (nm) 4Gb SLC NAND flash memory and 50nm 2Gb LPDDR to produce the most advanced NAND-LPDDR MCP combination in the market. Micron's new 4Gb NAND-2Gb LPDDR MCP is targeted at smart phones, personal media players and emerging MIDs where small form factor, low-cost and power savings are critical features.

Micron is currently sampling the 4Gb NAND-2Gb LPDDR MCP with customers and expects to be in volume production in early 2010. The 4Gb NAND-2Gb LPDDR combination is targeted at mainstream densities in today's mobile devices, but Micron has the flexibility to support higher densities -- up to 8Gb NAND and 8Gb LPDDR -- as the mobile market integrates sophisticated multimedia functionality. Visit the Micron Innovations blog to learn more about Micron's new MCP products and read an insider's perspective on the shifting mobile memory landscape.

"With Micron's 34nm 4Gb NAND and 50nm 2Gb LPDDR monolithic die used in this package, we are providing customers with the most advanced solution available in NAND-based MCPs," said Eric Spanneut, director of mobile memory marketing. "By combining the industry's leading NAND and DRAM processes within our new generation of MCPs, we are able to easily accommodate the shift to high-density NAND devices as the industry progresses toward multi-function mobile devices."

In addition to its MCP portfolio, Micron also offers a host of memory products for the mobile market, including discrete NAND and LPDRAM parts, e-MMC 4.4 managed NAND solutions and NANDcode software. By working closely with the entire mobile value chain, including operating system and chipset vendors, Micron is in a unique position to offer customers a rich portfolio of engineering support and solutions for their respective design needs.

Relevant Links

There are other ways to stay up-to-date on Micron news:

-- Micron Innovations Blog: www.micronblogs.com

-- Micron on Twitter: http://twitter.com/microntechnews

-- Micron Pressroom: www.micron.com/media

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

This press release contains forward-looking statements regarding the production of Micron's new MCP portfolio. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

SOURCE: Micron Technology, Inc.

Micron Technology, Inc. 
Kirstin Bordner, 208-368-5487 
kbordner@micron.com

--Micron's 32Gb MLC and 16Gb SLC Enterprise NAND technology can be configured into multi-die, single packages enabling densities up to 32-gigabyte (GB) for MLC and 16GB for SLC

When designing solid-state storage for enterprise applications, standard SLC NAND has been the technology of choice because of its reliability and endurance. But customers are often challenged on how to cost-effectively reach their capacity requirements. Micron Technology, Inc. (NYSE:MU) is meeting customers' requirements by announcing today that it has leveraged its award-winning 34nm NAND process to manufacture an MLC Enterprise NAND device, which provides enterprise organizations a way to cost-effectively and reliably double their flash-based enterprise storage capacity (since MLC provides twice the capacity in the same die size as SLC). Micron's new MLC Enterprise NAND device achieves 30,000 write cycles -- a 6x increase in endurance when compared to standard MLC NAND. And for enterprise applications that are more performance driven, Micron today also introduced a 34nm SLC Enterprise NAND device that achieves 300,000 write cycles -- a 3x increase in endurance when compared to standard SLC NAND.

Additionally, leveraging the full performance capability of NAND, Micron's newest Enterprise NAND products also support the ONFI 2.1 synchronous interface, delivering a 4- to 5x improvement in data transfer rates when compared to legacy NAND interfaces. Micron's 34nm Enterprise NAND portfolio includes a 32Gb MLC NAND chip and a 16Gb SLC NAND chip that can be configured into multi-die, single packages supporting densities up to 32GB MLC and 16GB SLC, respectively. Micron is now sampling its Enterprise NAND products with customers and controller manufacturers, and is expected to be in volume production in early 2010. For further explanation on Micron's Enterprise NAND products, visit Micron's Innovations blog to catch a video that describes how Micron leveraged its mature 34nm NAND process to achieve these levels of reliability.

"By leveraging our mature 34nm NAND process, Micron has developed Enterprise NAND products that support customers' high-endurance requirements. These products ensure that enterprise organizations have a highly reliable NAND flash solution -- be it MLC or SLC -- for design into the broader enterprise storage platform," said Brian Shirley, vice president of Micron's memory group.

"The use of advanced NAND flash is required to achieve broad SSD adoption in enterprise applications," said Steffen Hellmold, vice president of business development at SandForce. "We are very excited to work with Micron and enable cost-effective, reliable, high-performance SSD solutions that support stringent enterprise lifecycle requirements."

Relevant Links

There are other ways to stay up-to-date on Micron news:

-- Micron Innovations Blog: www.micronblogs.com

-- Micron on Twitter: http://twitter.com/microntechpr

-- Micron Pressroom: www.micron.com/media

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

This press release contains forward-looking statements regarding the production of Micron's Enterprise NAND products. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

SOURCE: Micron Technology, Inc.

Micron Technology, Inc. 
Kirstin Bordner, 208-368-5487 
kbordner@micron.com