Qualcomm Incorporated

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Nokia-Qualcomm shoot-out in Delaware

www.electronicsweekly.com | 20 hours 48 minutes ago

The companies discussed terms for licensing newer, WCDMA patents, but failed to agree terms. Nokia said they were not worth as much as the older patents. Nokia has been putting $20m a quarter into an account to pay for licenses for WCDMA.

http://www.electronicsweekly.com/Articles/2008/07/18/44145/nokia-qualcomm-shoot-out-in-delaware.htm

Can TiVo Cash In on Broadband Video?

www.unstrung.com | Jul 17, 2008

Analysts are mixed about whether the latest bells and whistles to grace TiVo's stand-alone TiVo DVRs will translate into sub gains

http://www.unstrung.com/document.asp?doc_id=159364&site=cdn&f_src=unstrung_section_393

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Qualcomm Makes First Call with Chips Using TSMC's 45nm Technology | WDD Asia - Wireless Design &

www.wirelessdesignasia.com

Qualcomm's call was made on the first 45nm chips received from Taiwan Semiconductor Manufacturing Co., one of the world's largest dedicated semiconductor foundry.

http://www.wirelessdesignasia.com/article-7336-qualcommmakesfirstcallwithchipsusingtsmcs45nmtechnology-Asia.html

Spirit Wireless : GlobalStar Satellite Phones

The Qualcomm Fixed Site Series. Permanently installed to connect you to the Globalstar Network using an extreme weather antenna and a standard phone.

http://www.globalstarsales.com/

Google Android en el booth de Qualcomm (CTIA 2008)

youtube.com

Visitamos el booth de la compañía Qualcomm para conocer más sobre el programa que posiblemente tenga tu próximo teléfono en el futuro: Android de Google.

http://youtube.com/watch?v=OZp6pa76r1U

Qualcomm gives Eudora a Mozilla makeover | Tech News on ZDNet

news.zdnet.com

Telecommunications technology company Qualcomm is rebuilding its Eudora e-mail program using open-source Thunderbird software from the Mozilla Foundation. In the 1990s, Eudora caught on as a popular program for sending and receiving e-mail.

http://news.zdnet.com/2100-3513_22-6125008.html

 

Qualcomm and IMEC Collaborate on 3D Integration Research - Zibb.com

IMEC, an independent nano-electronics research institute in Europe, and Qualcomm announced that Qualcomm is an integrated circuit company that can participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration.

Qualcomm and IMEC researchers in the program will collaborate to understand and develop solutions for the use of 3D technologies in future wireless products.

"Now that Qualcomm, the world's leading fabless integrated circuit provider, has joined the 3D integration program, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."

According to the companies, IMEC's 3D integration program explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find solutions for the use of 3D interconnects at different levels of the wiring hierarchy.

"Three-dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."

Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.

((Comments on this story may be sent to newsdesk@closeupmedia.com))

((Distributed via M2 Communications Ltd - http://www.m2.com))

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Comments on this story may be sent to newsdesk@closeupmedia.com

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Tags: europe   industrial   packaging   president   products   research   technology   texas   wireless  

Companies: QUALCOMM Incorporated (QCOM)

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Qualcomm Elected to the Broadcast Mobile Convergence Forum's Governing Board - Zibb.com

Appointment of Senior Representative from MediaFLO Technologies Adds to Forum's Growing Diversity -

Qualcomm Incorporated, (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it has been elected to the governing board of the Broadcast Mobile Convergence Forum (bmcoforum), the leading worldwide industry association for mobile broadcasting services. Luigi Ardito, technical marketing lead for the Europe, Middle East and Africa (EMEA) regions for Qualcomm MediaFLO Technologies, was named Qualcomm's representative to the board at the Forum's annual plenary meeting in Berlin on 17 June 2008.

"We are pleased to welcome Qualcomm to our governing board in support of our mission to foster innovation and a technology-neutral market environment for mobile broadcasting," said Professor Dr. Claus Sattler, executive director of bmcoforum. "Qualcomm brings global experience to our board through their launch of commercial mobile broadcast services in the United States and successful trials in international markets, which supports our global approach for mobile broadcast convergence."

bmcoforum's governing board is comprised of 14 representatives elected by the group's 110 member organizations from the telecommunications, broadcast and content industries. In its new board role, Qualcomm will help guide the bmcoforum as it promotes an open market approach to mobile broadcast services. The Forum's aim is to accelerate the commercial implementation of new user experiences for receiving broadcast services on mobile devices through activities such as promoting technology standardization and lobbying for spectrum and suitable regulatory frameworks.

"The content, broadcast and telecommunications industries are converging through mobile broadcast technologies, and we are committed to helping further the bmcoforum's efforts to accelerate adoption of these technologies through an open market approach," said Chem Assayag, senior director of business development, EMEA for Qualcomm MediaFLO Technologies. "Consumers want broadcast services that feature a variety of content underpinned by an exceptional user experience, which places technologies such as MediaFLO at the heart of this convergence. We look forward to sharing our global insights with the bmcoforum member companies."

Qualcomm Incorporated (http://www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2008 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

Qualcomm Contact:
    Richard Tinkler, Qualcomm Europe
    Phone: +44-7720-060619
    Email: rtinkler@qualcomm.com

    Tina Asmar, Corporate Communications
    Phone: +1-858-845-5959
    Email: corpcomm@qualcomm.com

    John Gilbert, Investor Relations
    Phone: +1-858-658-4813
    Email: ir@qualcomm.com

Web site: http://www.qualcomm.com

Richard Tinkler, Qualcomm Europe, +44-7720-060619, rtinkler@qualcomm.com, or
Tina Asmar, Corporate Communications, +1-858-845-5959, corpcomm@qualcomm.com, or
John Gilbert, Investor Relations, +1-858-658-4813, ir@qualcomm.com, all of
Qualcomm Incorporated

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Companies: QUALCOMM Incorporated (QCOM)

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Qualcomm Declares Quarterly Cash Dividend - Zibb.com

Qualcomm Incorporated (Nasdaq: QCOM) today announced a quarterly cash dividend of $0.16 per common share, payable on September 26, 2008 to stockholders of record at the close of business on August 29, 2008.

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2008 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

    Qualcomm Contact:
    John Gilbert
    Vice President of Investor and Industry Analyst Relations
    1-858-658-4813 (ph) 1-858-651-9303 (fax)
    ir@qualcomm.com (email)

SOURCE Qualcomm Incorporated

http://www.qualcomm.com

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Companies: QUALCOMM Incorporated (QCOM)

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Qualcomm MEMS and Foxlink to open mirasol fabrication plant in Taiwan - Zibb.com

Qualcomm MEMS Technologies, a wholly owned subsidiary of Qualcomm, and Cheng Uei Precision Industry, a developer and manufacturer of communications devices, computers and consumer electronics, have signed an agreement to develop a new mirasol fabrication plant in Lungtan's Science Park in Taoyuan, Taiwan.

This plant will manufacture Qualcomm's next generation mirasol displays. The fabrication plant is slated to be fully operational in 2009.

In support of the effort, Cheng Uei Precision Industry (Foxlink) has created a new business unit to support the production of Qualcomm MEMS Technologies' mirasol displays.

Jim Cathey, vice president of business development for Qualcomm MEMS Technologies, said: "Foxlink has decades of experience in delivering quality, timely products for global brand leaders. They are an ideal company with which to collaborate in delivering on the promise of mirasol's low-power, highly reflective displays."

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Companies: QUALCOMM Incorporated (QCOM)

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