Substrates supports sub-45 nm applications and architectures.

news.thomasnet.com | Jul 25, 2008

July 25, 2008 - Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to ±10 Angstroms.

http://news.thomasnet.com/fullstory/546912

TriQuint Announces Second Quarter Results (Business Wire)

biz.yahoo.com | Jul 23, 2008

TriQuint Announces Second Quarter Results. - HILLSBORO, Ore.--(BUSINESS WIRE)--TriQuint Semiconductor, Inc. (NASDAQ:TQNT - News), a supplier of high performance products for wireless communications, announces its financial results for the quarter ended June 30, 2008, including the following

http://biz.yahoo.com/bw/080723/20080723006200.html?.v=1

Lattice Power Has Silicon Substrate LED

www.semiconductor.net | Jul 23, 2008

Lattice Power Corp. (Nanchang, China) said it is in production with light-emitting diodes (LEDs) made with its proprietary silicon-substrate technology. The company deposits GaN light-emitting materials on silicon substrates, reducing costs.

http://www.semiconductor.net/article/CA6581064.html?nid=3664

Peregrine Semiconductor Ships 300 Millionth UltraCMOS RFIC

www.compoundsemi.com | Jul 23, 2008

Peregrine Semiconductor of San Diego, California USA reports that it has shipped its 300 Millionth UltraCMOS RFIC. The company says that it reached the shipping milestone with an order for its PE42672 SP7T RF switches that are designed into RF transmit and front-end modules for cellular handsets

http://www.compoundsemi.com/documents/articles/news/10519.html#top

ScienceDirect - Browse Journals and Books - By Subject

www.sciencedirect.com

Copyright © 2007 Elsevier B.V. All rights reserved. ScienceDirect® is a registered trademark of Elsevier B.V.

http://www.sciencedirect.com/science?_ob=BrowseListURL&_type=subject&_title=G&sc=16&content=journals&content=books&entitle=sub&entitle=nsub&_acct=C000050221&_version=1&_urlVersion=0&_userid=10&md5=d9f7976777d2118abdcf2663b9fb9f66&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y&clearQS=y

Technologies and Devices International, Inc.

Technologies and Devices International, Inc. (TDI) develops, manufactures and markets electronic components using III-V nitride semiconductor materials and silicon carbide. TDI produces variety of GaN, AlN and AlGaN epitaxial materials on sapphire and SiC substrates.

http://www.tdii.com/

PRWeb: Technology Hardware / Peripherals

computers.news.prweb.com

... as well as detailed case studies from companies pioneering in this market. Juniper Research interviewed 37 senior executives across a wide range of vendors and operators. Whitepaper ...

http://computers.news.prweb.com/ebooknews/techhardware_digest.pdf

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