Small Outline Packages (SOP)
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Companies listed for
Small Outline Packages (SOP) 
Read-Out
Dedham, MA
US
Read-Out in Dedham, MA, US (United States) - Manufacturing Execution Systems, Mechanical Engineering Design, Dissolved Oxygen Meters, Operator Interface Systems, Personal Computer (PC) Cards, Pneumatics, Portable Appliance Testers (PAT), Uninterruptible Power Supplies (UPS), Process Control System
Company location:
The House of Portfolios Co. Inc.
New York, NY
US
The House of Portfolios Co. Inc. in New York, NY, US (United States) - Nylon Cases, Portfolios, Presentation Boxes or Cases, Clam Shell Small Outline Packages (SOP), Presentation Binders available from The House of Portfolios Co. Inc. based in New York, NY. Click the links below to visit our
TEL: +212 206 7323
FAX: +212 633 2247
http://www.houseofportfolios.com
Company location:
News and Blogs

Total : 49 View more »
Toshiba unveils low-voltage Mosfets for notebooks
cbronline.com | Feb 29, 2008
Toshiba America Electronic Components has added to its range of power metal-oxide-semiconductor field-effect transistors with low-voltage offerings for notebook PCs and other handheld devices.
http://cbronline.com/article_news.asp?guid=2999B522-C0F4-40B5-AE6F-31091FCCCDBB
Expect prices for standard logic to sprout
www.purchasing.com | Jun 15, 2006
Since 2001, buyers have enjoyed falling prices and short leadtimes for standard logic. However, strong across-the-board demand and tight packaging capacity for some products is resulting in longer leadtimes and firming prices for standard logic. Because of strong first-quarter demand and firming
http://www.purchasing.com/article/CA6341040.html?industryid=48405
Molding Compound
www.semiconductor.net | Sep 15, 2004
The Hysol GR725-AG high-temperature molding compound is suited to under-the-hood automotive applications, and is capable of withstanding harsh environmental conditions. The material replaces epoxy moldings containing brominated flame retardants and antimony trioxide, which can degrade gold wires
Optocoupler shrinks to BGA package
www.electronicsweekly.com | May 6, 2004
Fairchild Semiconductor has dramatically reduced the size of its optocouplers with its first single-channel device with a transistor output housed in a BGA (ball grid array) package.
http://www.electronicsweekly.com/products/2004/05/06/53/optocoupler-shrinks-to-bga-package.htm
Web Sites

Total : 208 View more »
PlantCML - Transportation - ORION CADStar
ORION CADStar is a Computer-Aided Dispatch (CAD) application for small to medium emergency call centers. A map-centric design, robust feature set, scalability and configurability make it an ideal choice for mission critical communications.
http://www.cmles.com/solutions/transportation/orion-cadstar.asp
Microsoft Word - frontpagetemplate.doc
www.rapidonline.com
Page 1 of The enclosed information is believed to be correct, Information may change ‘without notice’ due to product improvement. Users should ensure that the product is suitable for their use. E. & O. E. Revision A 04/07/2003
Global Semiconductor Forum - ChipPAC Assembly and Test Facility, Shanghai
ChipPAC has announced its intention to build a facility that will more than double the company's capacity at its site in the Qingpu District of Shanghai.
Los Gatos, CA - US (United States)
www.kellysearch.com
Office Furniture, Discount Office Furniture - The premier Internet source for office furniture. We carry all that you will need to furnish your office or any other type of workspace.
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