Tessera Issues Update on Patent Office Actions

Tessera Technologies has provided a status update on certain U.S. Patent and Trademark Office (PTO) actions.

In a release dated June 25, Tessera stated:

- On June 22, the PTO issued documents in the patent reexamination proceedings involving Tessera's US Patent No. 5,852,326 (the '326 patent), and US Patent No. 6,465,893 (the '893 patent). In the ex parte reexamination proceeding of the '326 patent, the PTO issued an Advisory Action restating and revising the rejections of patent claims subject to reexamination that had been set forth in the previous Final Action. The '326 patent's validity has been upheld in litigation, including in the recently-concluded International Trade Commission (ITC) action, ITC Inv. No. 337-605 (Wireless ITC action) against Motorola, Qualcomm, Freescale and others. In the inter partes reexamination proceeding of the '893 patent, the PTO issued a Right of Appeal Notice restating and revising the prior rejections of the claims under reexamination. Tessera is currently reviewing its options related to both of these proceedings.

- Unless the Right of Appeal Notice or Final Action are withdrawn by the PTO, the reexamination proceedings relating to each patent may now move on to the Board of Patent Appeals and Interferences, after which they may go back to the Examiner, or proceed to further appeal in the U.S. Court of Appeals for the Federal Circuit. Typically, these appellate procedures can take many years to be resolved. The claims of a patent undergoing reexamination remain valid. A reexamination certificate cancelling, changing or confirming existing claims can only be issued after all appeals in a reexamination proceeding have been exhausted.

Tessera Technologies invests in, licenses and delivers miniaturization technologies for next-generation electronic devices. The company said its micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology.

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