Microsemi Power Modules Qualified for Applications in Rigorous Moisture Conditions

Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, has announced that its entire range of power modules in SP1, SP3, SP4, SP6 and SP6-P packages has been qualified to Moisture Sensitivity Level 1 as established in the JEDEC industry standards.

Qualification to the IPC/JEDEC J-STD-020D.01 standard enables Microsemi's extensive portfolio of SP-packaged power modules to be designed within systems that operate in harsh moisture conditions, such as those encountered by solar inverters, welders and automobiles.

"This qualification provides significant assurance to our customers that their products will perform as specified in applications exposed to high moisture conditions," said Philippe Dupin, Director of Microsemi's Power Module Products in Bordeaux, France. "It creates strong support for us in these demanding markets."

Microsemi's portfolio of SP-packaged power modules can be viewed on the Microsemi website: http://www.microsemi.com.

About Microsemi

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning its entire range of power modules in SP1, SP3, SP4, SP6 and SP6-P packages having been qualified to Moisture Sensitivity Level 1 as established in the JEDEC industry standards, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

This news release was distributed by GlobeNewswire, www.globenewswire.com

SOURCE: Microsemi Corporation

CONTACT:  Microsemi Corporation
Financial Contact:
John Hohener, Vice President and CFO
(949) 221-7100
Editorial Contact:
Cliff Silver, Corporate Communications Manager
(949) 221-7100

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