Broadcom announces new generation of Bluetooth headset SoC solutions

Semiconductor solutions provider Broadcom Corporation (Nasdaq:BRCM) announced on Friday its fourth generation of Bluetooth headset system-on-a-chip (SoC) solutions.

The company said the new the Broadcom BCM2074x family of Bluetooth headset SoC solutions introduces 65nm CMOS headset chips and adds such features as new wind noise reduction algorithms, multi-language 'voice prompt' technology and integrated fast-charging power innovations.

The new product family offers enhanced noise suppression capabilities can reduce background noise by nearly 40% when compared with existing noise cancellation techniques. The SmartAudio technology upgrades include dynamic wind noise suppression and near-end speech enhancement algorithms, including dynamic compression and spectral shaping.

New headsets based on the BCM2074x platform can provide more than 4 hours of talk time after a 5 minute charge. In addition, the new platform enables double the talk time overall of other devices, the company said.

Broadcom also said it has added innovations in the applications design for an improved pairing experience, in the basic and advanced use cases, including multipoint, where users can access multiple phone handsets with a single headset device.

The Broadcom BCM2074x family of Bluetooth headset SoC solutions, including the Broadcom BCM20740 SoC (single microphone), the Broadcom BCM20741 SoC (single microphone with SmartAudio) and the Broadcom BCM20742 SoC (dual microphone with SmartAudio) are sampling to early access customers. No pricing details were disclosed.

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