TriQuint Highlights Success of CuFlip Technology
Feb 08, 2010 (Close-Up Media via COMTEX) --
Company: TriQuint Semiconductor, Inc. (TQNT)
TriQuint Semiconductor, a RF front-end product manufacturer and foundry services provider, highlighted the success of CuFlip, its patented flip chip interconnect technology, noting shipments of 100 million units.
In a news release, the company said its highest volume CuFlip product, the TQM7M5012, a HADRON II PA Module, utilizes this technology to power a variety of consumer devices.
The release said that the TQM7M5012 is a 5x5mm HADRON II Polar EDGE PAM, which is 50 percent smaller than previous generations. The module includes a power amplifier designed for GSM/EDGE wireless handsets and data devices in GSM 850 / 900 / 1800 / 1900 bands. It supports both class 12 GPRS mode and E2 open loop polar EDGE mode, while delivering current consumption and noise performance in the critical GMSK mode improving handset battery life and thermal efficiencies.
Stuart Laval, Product Marketing Manager for TriQuint Semiconductor, said "CuFlip technology is a strategic differentiator for TriQuint. CuFlip enables superior RF performance and design flexibility. The CuFlip technique speeds manufacturing and assembly of the products, enabling cost savings we are able to pass on to our customers."
More information:
www.triquint.com
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Company: TriQuint Semiconductor, Inc. (TQNT)
Related terms: consumer, manufacturing, pennsylvania, semiconductors, technology, wireless
