<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/"><channel><title>Zibb.com: Electronics/Design Issues &amp; Characteristics/Heat Dissipation (All Sources)</title><link>http://www.zibb.com/electronics/interstitial/all/Electronics_Design+Issues+%26+Characteristics_Heat+Dissipation</link><atom:link rel="self" type="application/rss+xml" href="http://www.zibb.com/electronics/interstitial/all/Electronics_Design+Issues+%26+Characteristics_Heat+Dissipation" /><description>
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      </title><link>http://www.eicsolutionsinc.com/</link><description>EIC Solutions manufactures a complete line of electronic enclosures and solid state, thermoelectric air conditioners designed to protect PC's and other types of industrial control equipment from harsh environments.</description><guid>http://www.eicsolutionsinc.com/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.eicsolutionsinc.com" /></item><item><title>Designing with LEDs: Agenda</title><link>http://www.edn.com/article/CA6621922.html</link><description>9:15 – 9:45: Keynote address: Beyond Energy Efficiency—Opportunities to Influence Human Behavioral Response with Solid-State Lighting, Cary Eskow, director, Lightspeed, Avnet Electronics Marketing</description><guid>http://www.edn.com/article/CA6621922.html</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Thu, 11 Dec 2008 12:01:00 GMT</pubDate><source url="http://www.edn.com" /></item><item><title>SS_Fragments_Plain - Press Release</title><link>http://www.microchip.com/stellent/idcplg?IdcService=SS_GET_PAGE&amp;nodeId=2018&amp;mcparam=en013068&amp;from=rss</link><description>Microchip Technology myMicrochip Login | English | Chinese 中文 | Japanese 日本語 Search: Click here to Search Microchip.com Home Site Map Site FAQs Browser Specification RSS Feeds myMICROCHIP Products 8-bit PIC® Microcontrollers 16-bit PIC® MCUs &amp; dsPIC® DSCs 32-bit PIC® Microcontrollers Analog &amp;</description><guid>http://www.microchip.com/stellent/idcplg?IdcService=SS_GET_PAGE&amp;nodeId=2018&amp;mcparam=en013068&amp;from=rss</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Mon, 19 Oct 2009 14:55:00 GMT</pubDate><source url="http://www.microchip.com" /></item><item><title>Wakefield Thermal Solutions</title><link>http://www.wakefield.com/</link><description>Our extrusion capabilities include a wide range of custom and standard extrusions with widths up to 11-inches, as well as fabricated and assembled components.</description><guid>http://www.wakefield.com/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.wakefield.com" /></item><item><title>Verotec 1U 19in chassis for cPCI and VME64x systems</title><link>http://www.electronicsweekly.com/Products/Product.aspx?liProductID=20943</link><description>Verotec releases a 1U desktop or 19in rack mount powered and thermally managed chassis.</description><guid>http://www.electronicsweekly.com/Products/Product.aspx?liProductID=20943</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Tue, 05 May 2009 08:15:00 GMT</pubDate><source url="http://www.electronicsweekly.com" /></item><item><title>Heat Technology Inc. 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      </title><link>http://www.streetrodstuff.com/</link><description>These replace dim bulbs with very bright LED arrays specifically designed to bolt-in to your car. LED taillight kits from Technostalgia come complete with all hardware and wiring. Kits available for most makes and models.</description><guid>http://www.streetrodstuff.com/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.streetrodstuff.com" /></item><item><title>HEAT UP.COOL DOWN. BEHR</title><link>http://electronics.zibb.com/trademark/heat+up.cool+down.+behr/29740266</link><description>. Full trade mark registration details, registered images and more information below.</description><guid>http://electronics.zibb.com/trademark/heat+up.cool+down.+behr/29740266</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://electronics.zibb.com" /></item><item><title>Japanese Products Corporation</title><link>http://www.e-jpc.com/</link><description>JPC offers Product Solutions including high performance, high quality, and high reliability Brushless DC Motors and Fans, Stepper Motors, PMDC Brush Motors and Value-Added capabilities that differentiate your products.</description><guid>http://www.e-jpc.com/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.e-jpc.com" /></item><item><title>Computer Processing Unit Cooling Active Fan Heat Sinks in UK</title><link>http://electronics.zibb.co.uk/suppliers/Computer+Processing+Unit+Cooling+Active+Fan+Heat+Sinks/gb/25669285</link><description>Computer Processing Unit Cooling Active Fan Heat Sinks - UK Results - of 0 British Companies</description><guid>http://electronics.zibb.co.uk/suppliers/Computer+Processing+Unit+Cooling+Active+Fan+Heat+Sinks/gb/25669285</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Tue, 11 Sep 2007 00:00:00 GMT</pubDate><source url="http://electronics.zibb.co.uk" /></item><item><title>LED TV Exclusive Interview (1) - Samsung Taiwan: The Developing T...
      </title><link>http://www.ledinside.com/interview_Samsung_LEDTV_20090930_en</link><description>LEDinside covers LED technology development, LED market trend, and financial information of the global and regional LED industry.</description><guid>http://www.ledinside.com/interview_Samsung_LEDTV_20090930_en</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Wed, 30 Sep 2009 00:00:00 GMT</pubDate><source url="http://www.ledinside.com" /></item><item><title>Computer Hardware | Simline Australia's #1 Online Computer Store</title><link>http://www.simline.com.au/</link><description>Copyright © Simline Solutions Pty Ltd 1997-2009. All rights reserved. All brand names throughout this website are trademarks of their respective holders.</description><guid>http://www.simline.com.au/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.simline.com.au" /></item><item><title>Use thermoelectric coolers with real-world heat sinks</title><link>http://www.edn-europe.com/usethermoelectriccoolerswithrealworldheatsinks+article+2197+Europe.html</link><description>Peltier devices, also known as solid-state refrigerators, or TECs (thermoelectric coolers), actively cool temperature-sensitive electronic components, such as optical detectors and solid-state lasers. A glance at any TEC data sheet reveals that some primary and fairly easily understood parameters</description><guid>http://www.edn-europe.com/usethermoelectriccoolerswithrealworldheatsinks+article+2197+Europe.html</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.edn-europe.com" /></item><item><title>SOURCE GUIDE: Cooling Devices</title><link>http://www2.electronicproducts.com/SOURCE_GUIDE_Cooling_Devices-article-SG_Cooling_1_Aug2009-html.aspx</link><description>Search Sign In | Register Tuesday, August 25, 2009 Home Feature Articles New Products News Reference Designs What's Inside Energy Saving Multimedia Blogs Part Search Technology Centers Analog / Mixed Signal ICs Board Level Products Computer Peripherals Digital ICs Discrete Semiconductors</description><guid>http://www2.electronicproducts.com/SOURCE_GUIDE_Cooling_Devices-article-SG_Cooling_1_Aug2009-html.aspx</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Tue, 25 Aug 2009 00:00:00 GMT</pubDate><source url="http://www2.electronicproducts.com" /></item><item><title>Analog Associates Webpage</title><link>http://www.analogassociates.com/</link><description>&gt; BriskHeat : Semiconductor Manfuacturing Tools - foreline/exhaust line weldment and gasbox heat generation &amp; control - 1/4" - 18" and strucutres.</description><guid>http://www.analogassociates.com/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.analogassociates.com" /></item><item><title>Cooling Software Builds Models Entirely From Intelligent Objects</title><link>http://www.ecnmag.com/Product-Cooling-Software-Builds-Models-Entirely-From-Intelligent-Objects-080309.aspx</link><description>Future Facilities has introduced its 6SigmaET electronic cooling software. It is capable of building the model entirely from intelligent objects which speeds up model creation, enables automatic gridding and simplifies post-processing. It supports the</description><guid>http://www.ecnmag.com/Product-Cooling-Software-Builds-Models-Entirely-From-Intelligent-Objects-080309.aspx</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate>Mon, 03 Aug 2009 19:30:00 GMT</pubDate><source url="http://www.ecnmag.com" /></item><item><title>Tape and Reel</title><link>http://www.ox3.com/</link><description>When OEM s, CEM s, and Distributors need semiconductor devices packaged into carrier tape, trays, or tubes, OX3 often responds on a same-day basis. This is why manufacturers all around the world recognize that at OX3: We move semiconductors to the next level®.</description><guid>http://www.ox3.com/</guid><category domain="http://www.zibb.com">Electronics/Design Issues &amp; Characteristics/Heat Dissipation</category><pubDate /><source url="http://www.ox3.com" /></item></channel></rss>