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Packaging Supports Advanced Chips
semiconductor.net | Feb 1, 2009
Mahadevan Iyer is director of packaging for Texas Instruments’ technology and manufacturing business. In this interview, he talks about the future of packaging and how it is enabling device and system development through innovative technologies that have now made packaging a part of the circuit

-1 MATHENY: Welcome to this IBM Rational Podcast. I'm Angelique Matheny. Joining me for this...
www.ibm.com
-1 MATHENY: Welcome to this IBM Rational Podcast. I'm Angelique Matheny. Joining me for this podcast, Delivering Next Generation Converged Applications with Speed and Quality, is Derek Baron, Worldwide Rational Communications Industry Offerings Manager, and Jim Conallen, a software engineer on

IBM Research | Projects | Symbiosis | Audio
www.research.ibm.com
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