The biggest semiconductor trade show in North America, SEMICON WEST 2008 has concluded couple of days ago (15-17 July). One of impending issues facing the semiconductor industry is the lithography solutions for 32nm and 22nm.

http://sikod.com/blog/2008/07/23/semicon-west-double-patterning-for-32nm-and-22nm/

Put Up Or Shut Up On 450mm (Mannerisms)

Blog | www.electronicsweekly.com | Jul 22, 2008

There seems to be a schism opening up between the semiconductor industry and the semiconductor production equipment industry....

http://www.electronicsweekly.com/blogs/david-manners-semiconductor-blog/2008/07/put-up-or-shut-up-on-450mm.html

Micron's Patent Prowess Covered in Idaho Business Review

Blog | bulletin.micron.com | Jul 21, 2008

Micron was recently recognized by the Patent Board as the second most prolific company in semiconductors for patent innovation, and the recognition was covered in this week's Idaho Business Review.

http://bulletin.micron.com/2008/07/microns-patent.html

News 2008.07.20

Blog | www.embeddedstar.com | Jul 21, 2008

OPC Training Institute Reveals Top 20 OPC Integration Questions The OPC Training Institute (OPCTI) has released the 20 most common ...

http://www.embeddedstar.com/weblog/2008/07/20/news-20080720/

"CHIPS: UC claims EUV source breakthrough"

Blog | nextgenlog.blogspot.com | Jul 17, 2008

A new, cheaper laser light source for extreme ultraviolet (EUV) lithography has been patented by the University of California at San Diego (UCSD) in cooperation with Cymer Inc.--a maker of laser illumination sources for photolithography systems.

http://nextgenlog.blogspot.com/2008/07/chips-uc-claims-euv-source-breakthrough.html

Heard at SemiCon West: what lies beyond double-patterning lithography: EUV, e-beam, imprint technology, or the end of history?

Blog | www.edn.com | Jul 16, 2008

EDN Executive Editor Ron Wilson explores how IC design teams really work: the struggle for power efficiency and performance, wrestling with semiconductor processes and design methodologies, the challenges of global design teams. How do we somehow herd architecture, IP, design and verification into

http://www.edn.com/blog/1690000169/post/780030078.html?nid=3080

MIT researchers develop finer lines for microchips

Blog | www.tmworld.com | Jul 16, 2008

Massachusetts Institute of Technology (MIT) has reported that researchers have made significant advances in nanoscale lithographic technology, which is used in the manufacturing of computer chips and other electronic devices.

http://www.tmworld.com/blog/270000627/post/290030029.html

IBM@45: eDRAM, Si! High-k, No

Blog | www.semiconductor.net | Jun 27, 2008

It now appears that IBM Corp. plans to implement a high-bandwidth silicon-on-insulator (SOI) embedded DRAM (eDRAM) for its server microprocessors at 45 nm, and then introduce high-k/metal gate technology at the 32 nm node.

http://www.semiconductor.net/blog/270000427/post/520029052.html

Sipera Gets Upgraded SIP Security

Blog | www.voip-news.com | Jun 25, 2008

Sipera Systems Sipera IPCS security appliances now have advance security for SIP trunking. Sipera VIPER Engine also has upgraded security as well.Many enterprises today are embracing Unified Communications because they see it playing a key role in increasing the productivity of their

http://www.voip-news.com/blog/20080624/sipera-gets-upgraded-sip-security/