Directory Results 1-10 of 1,101

Sponsored Links

High Connection Density

SuperButton TM &SuperSpring TM Contact to replace spring probes

www.hcdcorp.com

Electronics Packaging

Foam packaging for electronics that protects against ESD, shock, etc.

www.ufpt.com

Cisco Unified SIP Phones 3900 Series - Products & Services - Cisco Systems

The Cisco Unified SIP Phone 3900 Series are cost-effective, entry-level Session Initiation Protocol (SIP) phones that addresses the needs of a lobby, laboratory, manufacturing floor, and hallway.

http://www.exio.com/en/US/products/ps7193/index.html

Atmel AT91SAM7S512, AT91SAM7X512, and AT91SAM7XC512: Microcontrollers have dual-bank-flash-memory-upgrade option

Product  |  www.edn.com | Mar 21, 2007

EDN's technical editors highlight notable new products including analog and digital ICs, power components, sensors, passives, boards and systems, software, and more. To submit products for consideration, send email to ednpressreleases@reedbusiness.com.

http://www.edn.com/index.asp?layout=blog&blog_id=1560000156&blog_post_id=480007648

Product Part

Contact Us My Account Login Company Products Sales Support Investors IP Processing Analog Solutions WAN Communications Product Tree Home > Products > Analog Solutions > Crosspoint Switches > 72x72 > M21130 > M21130-11 M21130-11 68x68 Crosspoint w/Input Equalization IC MSL: 72 Hours Package Type:

http://www.mindspeed.com/web/product/part.html;jsessionid=IZQn1AFRtDjWgyJ8C28v1XbqatnF6iDoHvA5zIUvDm1UgC6ADFDs!561618439?id=537&partNum=M21130-11&trail=2001,16,2020

Analog Devices ADA4937-1 and ADA4938-1: ADC drivers provide low distortion

Product  |  www.edn.com | Feb 26, 2007

EDN's technical editors highlight notable new products including analog and digital ICs, power components, sensors, passives, boards and systems, software, and more. To submit products for consideration, send email to ednpressreleases@reedbusiness.com.

http://www.edn.com/index.asp?layout=blog&blog_id=1560000156&blog_post_id=1670007167

Ansoft - Parics

Ansoft designed the ParICs Physical IC Modeler specifically to meet the needs of package engineering. With this automated modeling tool, engineers can generate models of leaded IC packages in minutes and use them for design, electrical characterization, and product documentation.

http://www.ansoft.com/products/tools/parics

Optimal Corp SiP Analysis suite: Vendor adds features to its SiP Analysis suite

Product  |  www.edn.com | Nov 9, 2006

EDN's technical editors highlight notable new products including analog and digital ICs, power components, sensors, passives, boards and systems, software, and more. To submit products for consideration, send email to ednpressreleases@reedbusiness.com.

http://www.edn.com/index.asp?layout=blog&blog_id=1560000156&blog_post_id=80005408

Sponsored Links

Cleanroom Poly

Packaging for Critical Parts Certified to Mil Standards & NASA

www.aeropackaging.com

IC Prototype Packaging

Plastic packages, IC Assembly, Wafer preparation, Custom services

www.icproto.com

Wafer Dicing, IC Assembly

Dicing, Open Cavity IC Packaging BGA Reballing, Plastic, Ceramic

www.majelac.com

IC Chip Assembly Services

Prototype Packgn, Ceramic, Plastic Scoop and Goop, Reball, Repackaging

www.icchippackaging.com

Semiconductor Packages

50um vias--25um traces-Quick Turns bga,flip chip,wb - Semi/Med/RF pkgs

www.aclusa.com

Results 1-10 of 1,101

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