Events
NEPCON China to Host First Edition at Shanghai World Expo Exhibition & Convention Center in 2012 |
NEPCON China to Host First Edition at Shanghai World Expo Exhibition & Convention Center in 2012. Asia’s leading electronics manufacturing trade event set to unveil four new segments - PR11741904
D17 Interconnect, EMC, ESD and Packaging Modelling | DATE - Design, Automation and Test in Europe
The Design, Automation, and Test in Europe (DATE) conference is the worlds premier conferences dedicated to electronic and embedded systems.
NEPCON China to Host First Edition at Shanghai World Expo Exhibition Convention Center in 2012 :
NEPCON China to Host First Edition at Shanghai World Expo Exhibition & Convention Center in 2012 : Electronics News from Electronic Specifier
IPC Thermal Management Conference Highlights What’s Cool in Today’s Technologies and Materials | IPC
IPC Technology Interchange on Thermal Management, Nov. 3–4, 2010, will cover the latest thermal management technologies for electronics manufacturing.
VS 150 Virtual Industries to Exhibit Vacuum Handling Solutions for Medical Applications at MDM
Virtual Industries to Exhibit Vacuum Handling Solutions for Medical Applications at MD&M Minneapolis 2011 : Electronics News from Electronic Specifier
VPG to Present Tutorial on Precision Resistors and ESD Issues at 2011 CMSE Conference : Electronics
VPG to Present Tutorial on Precision Resistors and ESD Issues at 2011 CMSE Conference : Electronics News from Electronic Specifier
PowerOne Presents 43KYear EnergySaving Solutions at EPA ENERGY STAR Server and Data Center
Power-One Presents $43K/Year Energy-Saving Solutions at EPA ENERGY STAR Server and Data Center Conference : Electronics News from Electronic Specifier
Submission form for a demonstration at the University Booth at DATE’10
Thermal Vias Based on Composite Materials Jörg Hertwig Technical University of Dresden Institute of Electromechanical and Electronic Design The continuous down-scaling of electronic systems into the nanoscale era presents a multitude of new design challenges. Thermal problems are one of the most
Algorithms for the Automatic Extension of an Instruction-Set
Algorithms for the Automatic Extension of an Instruction-Set Carlo Galuzzi, Dimitris Theodoropoulos, Roel Meeuws and Koen Bertels Computer Engineering, Delft University of Technology, The Netherlands {C.Galuzzi, D.Theodoropoulos, K.Bertels, R.Meeuws}@tudelft.nl Abstract—In this paper, two
Thermal Balancing Policy for Streaming Computing on Multiprocessor Architectures
Thermal Balancing Policy for Streaming Computing on Multiprocessor Architectures Fabrizio Mulas, Michele Pittau, Marco Buttu, Salvatore Carta, DMI-University of Cagliari 32 Via Ospedale, Cagliari, Italy [mulas,pittau,buttu,salvatore]@unica.it Andrea Acquaviva DI-University of Verona Strada le
