Events
11.2 High-Level Power and Thermal Management | DATE - Design, Automation and Test in Europe
The Design, Automation, and Test in Europe (DATE) conference is the worlds premier conferences dedicated to electronic and embedded systems.
IPC Thermal Management Conference Highlights What’s Cool in Today’s Technologies and Materials | IPC
IPC Technology Interchange on Thermal Management, Nov. 3–4, 2010, will cover the latest thermal management technologies for electronics manufacturing.
Laird Technologies Thermal Management Expert to Present at AMD Technical Forum Exhibition 2010 :
Laird Technologies Thermal Management Expert to Present at AMD Technical Forum & Exhibition 2010 : Electronics News from Electronic Specifier
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© 2007 IBM Corporation Systems & Technology Group 시스템 환경의 효율화와 전력 절감 방안 - The value of smart systems - The value of simplification IBM Systems & Technology Group 김 상 신 / 과장 전략 컴퓨팅 사업본부 2 Systems & Technology Group Presentation Title | Presentation Subtitle | Confidential © 2007 IBM Corporation
Submission form for a demonstration at the University Booth at DATE’10
Thermal Vias Based on Composite Materials Jörg Hertwig Technical University of Dresden Institute of Electromechanical and Electronic Design The continuous down-scaling of electronic systems into the nanoscale era presents a multitude of new design challenges. Thermal problems are one of the most
Microsoft PowerPoint - 3.Roger Schmidt_WW EEI Roadshow STG AP_최종.ppt
© Copyright IBM Corporation 2007 IBM Technology and Solutions Roger Schmidt, Ph.D Distinguished Engineer, Systems Development IBM Systems and Technology Group 2 © Copyright IBM Corporation 2007 IBM Systems and Technology Group IBM confidential until announcement Data center services Management
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© 2008 IBM Corporation 1 23 July 2008 Green Data Centers: How green computing can pay for itself Steven Sams VP, GTS Global Site and Facilities Services © 2008 IBM Corporation 2 Key Messages Energy efficiency is a global issue with significant impact today — and will have an even greater impact
Multi-Temperature Testing for Core-Based System-on-Chip
Multi-Temperature Testing for Core-based System-on-Chip Zhiyuan He, Zebo Peng, Petru Eles Department of Computer and Information Science Linköping University Linköping SE-58183, Sweden {zhihe, zebpe, petel}@ida.liu.se Abstract—Recent research has shown that different defects can manifest
Thermal Balancing Policy for Streaming Computing on Multiprocessor Architectures
Thermal Balancing Policy for Streaming Computing on Multiprocessor Architectures Fabrizio Mulas, Michele Pittau, Marco Buttu, Salvatore Carta, DMI-University of Cagliari 32 Via Ospedale, Cagliari, Italy [mulas,pittau,buttu,salvatore]@unica.it Andrea Acquaviva DI-University of Verona Strada le
Hotspot Prevention Through Runtime Reconfiguration in Network-On-Chip
Hotspot Prevention Through Runtime Reconfiguration in Network-On-Chip ∗ G. M. Link, N. Vijaykrishnan The Pennsylvania State University, University Park, PA, 16802 {link,vijay}@cse.psu.edu Abstract Many existing thermal management techniques focus on reducing the overall power consumption of the
