Electronics Foundries News

News

TSMC January sales
cdn.eetimes.com | Feb 10, 2012
Sales at foundry wafer processor TSMC were up 11.4 percent over December 2011 but down by 1.1 percent over the strong month of January 2011. < br/ > < br/ > View the full article < a href="http://www.eetimes.com/electronics-news/4236127/TSMC-January-sales" > HERE < /a > .

Samsung, Cadence partner in nanometer SoC design
www.eetasia.com | Feb 10, 2012
The companies will collaborate on a design-for-manufacturing (DFM) infrastructure to tackle physical signoff and electrical variability optimization for 32, 28 and 20nm ICs.

UMC to Initiate the Roll-Out of 28nm Chips Ahead of Schedule - X-bit labs
www.xbitlabs.com | Feb 9, 2012
UMC to Produce 28nm Design for Texas Instruments in Q2 - Report

CompoundSemi Online - The Original Compound Semiconductor Industry Newspaper
www.compoundsemi.com | Feb 9, 2012
MagnaChip Semiconductor Corporation announced that its Korean subsidiary has entered into a definitive agreement to acquire Dawin Electronics Co. Ltd., a privately held semiconductor company that designs and manufactures insulated gate bipolar transistors (IGBTs), fast recovery diode (FRD), and

UMC to boost 2012 capex to $2 billion
www.edn.com | Feb 9, 2012
Taiwanese semiconductor foundry UMC said it plans to spend about $2 billion on capital expenditures in 2012, up 25 percent from the roughly $1.6 billion it spent on capital expenditures in 2011.

Panasonic, Fujitsu, Renesas talk merger
www.electronicsweekly.com | Feb 8, 2012
Renesas, Panasonic and Fujitsu are talking about merging their semiconductor businesses. It is thought the process could take a year.

Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28-
www.nanowerk.com | Feb 6, 2012
Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design

in design Cadence Collaborates with Samsung Foundry to Deliver Design for Manufacturing Solution
www.electronicspecifier.com | Feb 6, 2012
Cadence Collaborates with Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design : Electronics News from Electronic Specifier

I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : TSMC plans 3-D IC assembly launch early in
www.i-micronews.com | Feb 2, 2012
Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.

inductotherm europe expands for largefurnace construction
www.foundrymag.com | Feb 1, 2012
Inductotherm Europe Expands for Large-Furnace Construction : “We now see coreless furnace orders of 35- to 85-metric ton capacity as the norm.”