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North American Engineering Student FPGA Competition Sign-Ups Open

News  |  www.altera.com | 1 hour 15 minutes ago

Ottawa, Canada, October 5, 2009—Altera Corporation (NASDAQ: ALTR), Terasic Incorporated, Impulse Accelerated Technologies Inc. and the Institute of Electrical and Electronics Engineers (IEEE) Canada today announced that sign-ups are open for the 2009 Innovate North America FPGA Competition.

http://www.altera.com/corporate/news_room/releases/2009/products/nr-innovate_na.html?f=hp&k=wn1

Rochester Electronics expands space-level manufacturing, radiation-hardened semiconductor offerings

News  |  MAE.pennnet.com | Nov 21, 2009

Military & Aerospace Electronics - Rochester Electronics expands space-level manufacturing, radiation-hardened semiconductor offerings - NEWBURYPORT, Mass., 21 Nov. 2009. Rochester Electronics, a source for discontinued semiconductors, is actively expanding its mission-critical product

http://MAE.pennnet.com/Articles/Article_Display.cfm?Section=EXECW&PUBLICATION_ID=32&ARTICLE_ID=371100&C=EXECW&dcmp=rss

Details of Intel's 32nm Atom emerge, on track for 2011

News  |  www.techspot.com | Nov 20, 2009

According to Fudzilla, some new information has emerged about Intel's 2011 Atom platform, which will be a successor to the imminent Pine Trail platform. Codenamed Cedar Trail, the 2011 refresh should bring the first Atom processors built with a 32nm fabrication. Behind the scenes, Fudzilla says

http://www.techspot.com/news/37049-details-of-intels-32nm-atom-emerge-on-track-for-2011.html

Applied-Semitool deal: What analysts are saying

News  |  www.eetimes.com | Nov 20, 2009

As reported, Applied Materials Inc. and Semitool Inc. this week announced a definitive agreement for Applied to acquire the outstanding shares of Semitool for $11 per share in an all-cash tender offer.

http://www.eetimes.com/news/semi/rss/showArticle.jhtml?articleID=221900486&cid=RSSfeed_eetimes_semiRSS

Toshiba develops molecular photoresist technology for EUV lithography

News  |  nanotechwire.com | Nov 20, 2009

Toshiba Corporation today announced that it has developed a high resolution photoresist (photo-sensitive film) essential for future application of EUV (extreme ultraviolet) lithography in semiconductor fabrication, and proved its viability with the world's first 20nm-scale generation process

http://nanotechwire.com/news.asp?nid=8996

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Semiconductor manufacturing equipment orders flat

News  |  www.electronicsweekly.com | Nov 20, 2009

Despite high fab capacity utilisation rates, there is no great rush to order new semiconductor manufacturing equipment.

http://www.electronicsweekly.com/Articles/2009/11/20/47481/semiconductor-manufacturing-equipment-orders-flat.htm

MEMS : Microvision Shares Plunge as it Plans Stock offering

News  |  www.i-micronews.com | Nov 20, 2009

Microvision, Inc. (NASDAQ:MVIS) plunged 23% to $3.18 after it intends to offer to sell, subject to market and other conditions, shares of its common stock in an underwritten public offering. Oppenheimer Co. Inc. and Thomas Weisel Partners LLC ...

http://www.i-micronews.com/lectureArticle.asp?id=3782

Ismosys to support Tectrol power products in Europe

News  |  www.eetimes.eu | Nov 20, 2009

Ismosys has signed a rep-stocking deal with Canadian power specialist Tectrol Inc, covering the key European territories of Benelux, Iberia, Central Europe (inc. Switzerland), Italy, France, UK, Ireland, Sweden, Turkey, the Nordic countries and Israel.

http://www.eetimes.eu/israel/221900431?cid=RSSfeed_eetimesEU_israel

Elpida Completes Development of 1Gb GDDR5 Chip, Mass Production Scheduled on Q2 2010

News  |  www.xbitlabs.com | Nov 20, 2009

Elpida Memory, the largest maker of dynamic random access memory (DRAM), in Japan, said Thursday that it had completed development of its first GDDR5 chip. Mass production of the new premium memory ICs will start in the second quarter of next year.

http://www.xbitlabs.com/news/memory/display/20091119223121_Elpida_Completes_Development_of_1Gb_GDDR5_Chip_Mass_Production_Scheduled_on_Q2_2010.html

Si substrate loss measured after ion implantation

News  |  www.electroline.com.au | Nov 20, 2009

IMEC has shown that spectroscopic ellipsometry can be used to measure Si substrate loss after ion implantation. With decreasing device dimensions, the need for this kind of metrology has become more and more important.

http://www.electroline.com.au/articles/37278-Si-substrate-loss-measured-after-ion-implantation?utm_source=feedburner&utm_medium=feed&utm_campaign=Feed%3A+Electroline-FeatureArticles+%28Electroline+-+Feature+Articles%29

 

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