Wafer Processing News

News

RTP140R060S RTP140R060SD TE Circuit Protections RTP Devices Thermal Protection AC and DC Designs :
www.electronicspecifier.com | Feb 10, 2012
TE Circuit Protection s New RTP Devices Offer Reflowable Thermal Protection in Low-Temperature AC and DC Designs : Electronics News from Electronic Specifier

I-Micronews - MEMS : sp3 diamond technologies experiences 73 percent revenue ...
www.i-micronews.com | Feb 8, 2012
Company sees strong adoption of HF CVD reactor technology, expands into larger headquarters.

IBM will manufacture some 32nm "Trinity" APUs for AMD - TechSpot News
www.techspot.com | Feb 6, 2012
AMD has reportedly enlisted IBM to manufacture some of its next-generation Fusion chips, code-named "Trinity". The move was disclosed by the company's CEO Rory Read at an analyst event and follows a string of low yield issues with 32nm chips

Atomic layer deposition of nanostructured materials for energy and environmental applications
www.nanowerk.com | Feb 2, 2012
Atomic layer deposition of nanostructured materials for energy and environmental applications

Intel's wireless chips denied latest processes
www.electronicsweekly.com | Feb 2, 2012
Intel’s move on the wireless market may fail for the same reason that its X-Scale and ASIC ventures failed – because it’s not putting its wireless parts on advanced processes.

Could 450mm wafers play away from the leading edge?
www.eetasia.com | Jan 30, 2012
When the processing of integrated circuits on 450mm diameter wafer comes, many assume that it will do so first for the most advanced digital manufacturing processes.

Globalfoundries: Plans for 14nm Process Technology Are Underway - X-bit labs
www.xbitlabs.com | Jan 27, 2012
Globalfoundries Continues to Praise Gate-First HKMG Process Technology

Conergy guides higher than expected 2011 loss and modestly lower revenue in 2012 | PV-Tech
www.pv-tech.org | Jan 24, 2012
Continued restructuring, inventory sell-off and than expected price declines in the fourth quarter, further impacted fourth quarter and full-year financial results at Conergy.

Soitec, Sumitomo offer 'smart-cut' GaN wafers
www.edn.com | Jan 24, 2012
Semiconductor manufacturing materials vendors Soitec and Sumitomo Electric Industries have announced that they have demonstrated four- and six-inch diameter engineered gallium nitride (GaN) wafer substrates and the launch of pilot production to enable wider market adoption.

CompoundSemi Online - The Original Compound Semiconductor Industry Newspaper
www.compoundsemi.com | Jan 17, 2012
Toshiba Imaging  has delivered the new, miniature, high definition, IK-HR1S camera to Grande Vitesse Systems (GVS) of San Francisco, California for integration into a ruggedized, digital video recording system for NASA.  Grande Vitesse Systems specializes in supplying high-broadcast-quality video