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Semiconductor Plastic Packaging Materials Market to Reach $20.2 Billion by 2011
News | www.prnewswire.com | Nov 28, 2007
Laminate Substrates, Valued at $6.2 Billion, Will Lead Sector Growth SAN JOSE, Calif., Nov. 27 /PRNewswire/ -- The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 billion in 2007 and grow to $20.
http://www.prnewswire.com/cgi-bin/stories.pl?ACCT=109&STORY=/www/story/11-27-2007/0004712576&EDATE=
ASE to leverage SUSS MicroTec’s litho equipment in wafer level packaging ops
News | www.edn.com | Nov 22, 2007
In its move towards more sophisticated semiconductor applications driven by market demands for faster, smarter, portable and integrated electronic products, the Taiwanese semiconductor assembly and test services provider will use lithography production equipment from Munich, Germany-based SUSS
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