Semiconductor Testing News

News

LEDs Magazine - Munich airport tests ewo LED flood lights for aprons and taxiways
www.ledsmagazine.com | 17 hours 13 minutes ago
In a new pilot project, ewo has installed LED flood lights on two high masts in the Munich airport, achieving 46% energy savings.

Advances in 3D-IC testing
www.eetasia.com | Feb 3, 2012
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.

Gamma Scientific to Showcase Comprehensive LED Testing Solutions at Strategies in Light | LEDinside
www.ledinside.com | Feb 2, 2012
Gamma Scientific, pioneers in light measurement for over 50 years, will be showcasing their complete line of LED test and measurement solutions in booths 501 and 600 at the Strategies in Light conference in Santa Clara, CA from February 7-9, 2012. Attendees can visit the Gamma Scientific booths to

Lightimes Online News and Resources for the LED and Solid State Lighting Industry and its Supply
www.sslighting.net | Feb 2, 2012
< a href='http://www.solidstatelightingdesign.com/images/120126_philips_lumileds_Luxeon_M1.jpg' > < img src='http://www.solidstatelightingdesign.com/images/tn_120126_philips_lumileds_Luxeon_M1.jpg' align='left' vspace='5' hspace='7' border='0' > < /a > Philips Lumileds has introduced Luxeon M, an

3D TSV Test: ATE challenges and potential solutions
cdn.eetimes.com | Jan 27, 2012
3D TSV Test: ATE challenges and potential solutions

Chroma ATE Unveils 58173-V Laser Diode Test System | PRLog
www.prlog.org | Jan 25, 2012
Chroma ATE Unveils 58173-V Laser Diode Test System. Chroma ATE has introduced its new Chroma 58173-V Laser Diode Test System, providing a total solution for VCSEL production lines from wafer to final package. The system is being unveiled this week at SPIE Photonics West in San Francisco,

I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : The fast track to 3D-IC testing...
www.i-micronews.com | Jan 19, 2012
Three-dimensional integrated circuit (3D-IC) systems offer the potential to deliver significant improvements in performance, power, functional density, and form factor over other packaging integration techniques. Despite substantial progress toward realizing 3D-IC systems, a variety of design,

Altair Semiconductor Releases Production Test Tool Based On The
www.rfglobalnet.com | Jan 4, 2012
Altair Semiconductor Releases Production Test Tool Based On The Rohde & Schwarz CMW500, Optimized For Testing Mobile Terminals Equipped With Altair LTE Chipsets - Altair

Elektra 2011 Awards - The Winners
www.electronicsweekly.com | Dec 16, 2011
Last night saw the Elektra 2011 European Electronics Industry Awards at the glamorous Park Plaza Hotel in London, and our capable host this year was the comedian Greg Davies with an enthusiastic audience representing all sectors of the industry.

Des connecteurs et terminaisons PHD38999 haute densit dITT ICS passent les tests de qualification
www.electronicspecifier.com | Nov 23, 2011
Des connecteurs et terminaisons PHD38999 haute densité d ITT ICS passent les tests de qualification pour environnements difficiles : Electronics News from Electronic Specifier