Electronics Convergence Industry News & Blogs

Industry News & Blogs

10GbE Converged Network Adapters Broadcom Industry Certification VMware vSphere 5 : Electronics
www.electronicspecifier.com | Feb 8, 2012
World's Fastest 10GbE Converged Network Adapters from Broadcom Earn Another Major Industry Certification - VMware vSphere 5 : Electronics News from Electronic Specifier

SpeechTechMag.com: DialMyCalls Launches Integration with Voice and SMS API
www.speechtechmag.com | Feb 7, 2012
The company's message alert system can now be integrated into new and existing Web applications.

100-Gb/s Transponder - Oclaro, Inc., Advanced Photonics Solutions (Photonics Spectra | Feb 2012 |
www.photonics.com | Feb 1, 2012
Oclaro Inc. has released the MI 8000XM, a low-power 100-Gb/s MSA-compliant coherent transponder that...

Component integration paces EV, hybrid power electronics efficiency
cdn.eetimes.com | Jan 27, 2012
Component integration paces EV, hybrid power electronics efficiency

Identive Launches New Converged Access Group - Printed Electronics Now
www.printedelectronicsnow.com | Jan 26, 2012
John Menzel appointed VP of Access Control ID Solutions

Toshiba IGBT has 1350V rating
www.electronicsweekly.com | Jan 17, 2012
Toshiba Electronics has introduced an integrated IGBT with a voltage rating up to 1350V

CES 2012: Samsung Looks To Deliver Convergence Umbrella
www.twice.com | Jan 12, 2012
#CES Las Vegas - Sharing and connectivity between platforms and devices is what Samsung promises for 2012 and beyond at International CES this week.

US Army Testing Demonstrates Readiness Of Raytheon's MAINGATE
www.rfglobalnet.com | Jan 12, 2012
US Army Testing Demonstrates Readiness Of Raytheon's MAINGATE Radio To Provide Tactical Networking Vision - Raytheon Company

Fusion-io Resold by Digital China
www.storagenewsletter.com | Dec 21, 2011
Welcome on StorageNewsletter.com OsNexsus Home About Us Submit News Editorial Policy Contact Us Site Map Advertise with Us Themes & Channels CES 2012 SNW Europe 2011 Systems (RAID, NAS, SAN) Software Hard Disk Drives Tapes Optical Connectivity (switch/HBA/ interface) Security Solid State (SSD,

I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : High performance TSV filled with Carbon
www.i-micronews.com | Dec 12, 2011
Researchers at Chalmers have demonstrated that two stacked chips can be vertically interconnected with carbon nanotube vias through the chips.