Industry News & Blogs

I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : TI introduces new WLCSP radio chips for mobile

Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) today introduced the WiLink 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC,

TEL joins CEA-Leti programs on DSA, maskless litho

TEL joins CEA-Leti programs on DSA, maskless litho

Energy Conversion Devices and subsidiaries file for bankruptcy | PV-Tech

Few should be surprised that Energy Conversion Devices (ECD) and wholly owned subsidiary, United Solar Ovonic (USO) have entered Chapter 11 proceedings in the US Bankruptcy Court for the Eastern District of Michigan.

Kaistar Lighting Invests $25 Million in Bridgelux | LEDinside – LED, LED Lighting, LED Price

Bridgelux Inc., a leading developer and manufacturer of LED lighting technologies and solutions, announced that Kaistar Lighting (Xiamen) Co., Ltd. has agreed to invest $25 million in the company. Bridgelux will use the equity investment to further accelerate research, development, and production

Imec rolls 300mm directed self-assembly process line

The fab-compatible patterning solution can pave the way for scaling EUV lithography to production level, pushing the boundaries of 193nm tech.

The world's first realization of high-quality germanium platform substrates

The world's first realization of high-quality germanium platform substrates

About Lorom

LOROM announces line of high-speed data center cables.

Cirrus Logic Energy Measurement ICs Offer Lowest Cost Solution While Optimizing Performance for

Cirrus Logic unveils family of AFE ICs for single/polyphase energy meters for smart grid.

Maskless e-beam litho good for 14-nm , says CEA-Leti

French research institute CEA-Leti has said that 22-nm lines and spaces have been created using direct-write e-beam lithography technology and that the demonstrated resolution meets the requirements for both 14- and 10-nm logic processing nodes.

Materials Today - Implementing educational change: heeding the messages from materials science

Change is the order of the day. However, this state of flux is not confined to materials scientists. Organisations such as the UK Centre for Materials Education (UKCME), charged with a remit to enhance student learning, are also in the business of change.

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