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MEMS : SENSORDYNAMICS LAUNCHES EXPANDED RANGE OF ALL-PURPOSE MEMS INERTIAL COMBO SENSORS
News | www.i-micronews.com | 13 minutes ago
Comprehensive portfolio of combo sensors makes SensorDynamics a preferred supplier for automotive, medical and industrial manufacturers
Nmap Development: Re: SIP version detection script
Press Release | seclists.org | 2 hours 32 minutes ago
Thanks for the explanation. It turned out that there's no need for that dynamic stuff to be in there in order to trigger a response, at least not for the equipment I tested it against using the static probe already in nmap.
Discovery Could Shed Light on Pancreatic Diseases
News | www.azonano.com | 3 hours 5 minutes ago
Using a small boron-based molecule, glucagon-a hormone that plays a key role in pancreatic diseases-can now be imaged in live pancreatic cells. This breakthrough discovery was made by a team led by Young-Tae Chang from the Singapore Bioimaging Consortium of A*STAR*.
Light Transformation Technologies Filed Patent Lawsuits against Numerous Companies | LEDinside -
News | www.ledinside.com | 6 hours 58 minutes ago
LEDinside covers LED technology development, LED market trend, and financial information of the global and regional LED industry.
http://www.ledinside.com/Light_Transformation_Technologies_20091125
Semiconductor Plastic Packaging Materials Market to Reach $20.1B by 2013
News | www.circuitree.com | 18 hours 56 minutes ago
Click here for full story
http://www.circuitree.com/Articles/Breaking_News/BNP_GUID_9-5-2006_A_10000000000000705408
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Semicon Packaging Materials Market to Reach $20.1B by 2013
Press Release | www.pcb007.com | 23 hours 31 minutes ago
The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.8 billion in 2009 and grow to $20.1 billion by 2013, according to a new study by SEMI and TechSearch International.
STATS ChipPAC's Copper Wire Bond Offering in Volume Production - Zibb.com
Press Release | www.zibb.com | Nov 23, 2009
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, announced today that its copper wire bond program is in volume production with the capability to support customers in five different
http://www.zibb.com/article/5688466/STATS+ChipPAC+s+Copper+Wire+Bond+Offering+in+Volume+Production
Electrolube DCA-FD suits harsh environments
News | www.electronicstalk.com | Nov 23, 2009
Electrolube has exhibited the DCA-FD - a modified silicone conformal coating that is touch-dry in 20 minutes - at Productronica.
Next Generation Messaging: Evolution to IMS and SIP
Press Release | www.prlog.org | Nov 23, 2009
Next Generation Messaging: Evolution to IMS and SIP. Next Generation Messaging: Evolution to IMS and SIP evaluates the evolving technology and market for messaging. This publication thoroughly addresses the evolution of SMSC towards 3G IP enabled SMSC, including analysis of 2nd generation GSM...
http://www.prlog.org/10423839-next-generation-messaging-evolution-to-ims-and-sip.html
Conquering the Univers(al)
Blog | circuitsassembly.com | Nov 20, 2009
USI is, of course, the world’s 24th largest – and Taiwan’s third largest, after Foxconn and Orient Semiconductor – provider of EMS services. It had 2008 EMS sales of $490.4 million, and EMS work makes up about 25% (or about $318 million) of its overall sales so far this year.
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