Industry News & Blogs Results 1-10 of 858

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Audiovox Corporation F4Q08 (Qtr End 2/29/08) Earnings Call Transcript

seekingalpha.com | May 15, 2008

<p>Audiovox Corporation (VOXX)</p><p>F4Q08 Earnings Call</p><br /><a href="http://seekingalpha.com/article/77449-audiovox-corporation-f4q08-qtr-end-2-29-08-earnings-call-transcript?source=feed">Complete Story »</a><div class="feedflare"><a

http://seekingalpha.com/article/77449-audiovox-corporation-f4q08-qtr-end-2-29-08-earnings-call-transcript?source=feed

What We Must Learn from the Big Dig Collapse

www.designnews.com | May 15, 2008

Engineering materials is a discussion led by Design News Contributing Materials Editor Doug Smock on important new developments and applications that affect mechanical design. Metals covered include all types of steel and nonferrous metals, in all shapes.

http://www.designnews.com/blog/380000238/post/380026638.html

Magma: YieldManager

edn.firstlightera.com | May 13, 2008

Achieve and maintain high yields by allowing engineers to collect, correlate, analyze and share critical data

http://edn.firstlightera.com/EN/Microsites/1/Magma/YieldManager.htm

3D carbon nanotube components integrated on carbon nanotube wafer

www.nanowerk.com | May 13, 2008

(Nanowerk News) National Institute of Advanced Industrial Science and Technology (AIST) manufactured integrated 3D carbon-nanotube components by using single-layer carbon nanotubes.

http://www.nanowerk.com/news/newsid=5688.php

Revealing images

www.laserfocusworld.com | May 12, 2008

While I’m sure there must be many (well … at least a few) “real” applications for the now-ubiquitous cell-phone cameras, these devices are typically regarded as more of a toy than a serious imaging device.

http://www.laserfocusworld.com/display_article/328488/12/ARTCL/none/colum/Revealing-images?dcmp=rss

Applied Tackles Edge With Inflexion Polishing System

www.semiconductor.net | May 7, 2008

Applied Materials introduced the Inflexion edge polishing system that has an integrated wafer cleaning capability. The Inflexion tool uses abrasive tape to clean the wafer’s edge, an area that faces new contamination issues as immersion lithography pushes liquids to the edge of the wafer.

http://www.semiconductor.net/article/CA6558269.html?nid=3657

IPC offers Technical Seminars at National Electronics Week

www.globalsmt.net | May 7, 2008

Global SMT & Packaging magazine, IPC offers Technical Seminars at National Electronics Week

http://www.globalsmt.net/content/view/3995/122/

IPC offers technical seminars at NEW - National Electronics Week

www.emsnow.com | May 5, 2008

IPC is pleased to announce a series of in-depth technical seminars to be held in conjunction with National Electronics Week (NEW). Focusing on next generation technologies in design, fabrication and assembly, the IPC technical seminars will take place June 17-19, 2008 at Earls Court, London.

http://www.emsnow.com/npps/story.cfm?pg=story&id=33283

SIA starts anti-counterfeiting effort

www.electronicsweekly.com | Apr 25, 2008

To help combat the growing problem of counterfeit components entering the supply chain, the Semiconductor Industry Association (SIA) released a directory of authorised distributors this week as part of a larger campaign that involves working with customs authorities to seize counterfeits at the

http://www.electronicsweekly.com/Articles/2008/04/25/43606/sia-starts-anti-counterfeiting-effort.htm

Aonix Launches PERC Ultra 5.1

edageek.com | Apr 15, 2008

Aonix®, the provider of the PERC product line for embedded and real-time Java developers, launched the latest version of PERC ...

http://edageek.com/2008/04/14/java-6/

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