Industry News & Blogs Results 1-10 of 806

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Verigy to Present at the Cowen 20/20 TMT Conference (Business Wire)

biz.yahoo.com | May 14, 2008

Verigy to Present at the Cowen 20/20 TMT Conference. - CUPERTINO, Calif.--(BUSINESS WIRE)--Verigy (NASDAQ: VRGY - News), a premier semiconductor test company, today announced that Bob Nikl, chief financial officer, and Judy Davies, vice president of investor relations, will present to the

http://biz.yahoo.com/bw/080514/20080514006173.html?.v=1

Global Semiconductor Test Consortium (STC) Conference

edablog.com | May 14, 2008

The Global STC Conference (GSC) will be held on June 4th-6th in San Diego, California. This year theme is Collaborative ...

http://edablog.com/2008/05/13/gsc-2008/

2.4-Watt Flame Tip LED Chandelier Bulb with Standard Edison Base, Replaces 20W Incandescent Bulbs

www.led-professional.com | May 14, 2008

LED professional - Light Emitting Diode (LED), Solid State Lighting (SSL), LED, OLED, LED optics, LED driver, LED IC, LED Thermal Management, LED luminary, LED fixture, Light Emitting Diode, LED Technology, Application, 2.4-Watt Flame Tip LED Chandelier Bulb with Standard Edison Base, Replaces 20W

http://www.led-professional.com/content/view/1015/56/

Chipond echoes Novatek with optimistic LCD driver IC outlook for 2Q

www.digitimes.com | May 13, 2008

Following Novatek Microelectronics' projection for a warming up LCD driver IC in the second quarter, Chipbond Technology chairman Fei-Jain Wu echoed the sentiment, saying that demand for LCD driver packaging is healthy with demand about to trend stronger.

http://www.digitimes.com/news/a20080513PD213.html

Keithley Releases CD of Semiconductor Device Test Applications

www.globalsmt.net | May 12, 2008

Global SMT & Packaging magazine, Keithley Releases CD of Semiconductor Device Test Applications

http://www.globalsmt.net/content/view/4027/76/

STATS ChipPAC Completes Full Qualification of Fan-in Package-on-Package Technology

www.edn.com

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" - SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced it has completed full internal qualification of its Fan-in Package-on-Package (FiPoP) technology.

http://www.edn.com/pressRelease/2140210619.html?nid=3375

tm_news_051208_2

www.advantest.com | May 12, 2008

Advantest introduces high-volume next-generation high-speed DDR3-SDRAM tester.

http://www.advantest.com/aac/News/042308.html

ASE Inc. and ASE Test Announce Anticipated Effective Date of Proposed 'Going Private' Acquisition of ASE Test by ASE Inc.

www.prnewswire.com

of the outstanding ordinary shares of ASE Test that ASE Inc. does not directly or indirectly own by way of a scheme of arrangement under Singapore law (the ''Scheme''). ASE Inc.

http://www.prnewswire.com/cgi-bin/stories.pl?ACCT=109&STORY=/www/story/05-09-2008/0004810016&EDATE=

Test is a Four Letter Word

www.eebeat.com | May 8, 2008

Test. When you read or hear that word, what do you think of or how does it make you feel? Do you remember your school days where you maybe sweated through a test, exam, or quiz? Yikes, those are also four letter words.

http://www.eebeat.com/?p=834

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