Chip Production Press Releases

Press Releases

300mm DSA Imec 300mm fab compatible directed self assembly process line : Electronics News from
www.electronicspecifier.com | Feb 10, 2012
Imec announces world-first 300mm-fab compatible directed self-assembly process line : Electronics News from Electronic Specifier

Successful Adoption of DFM
cdn.eetimes.com | Feb 6, 2012
Two factors are influencing the use of DFM for IC development at 28 nm and below. First, foundries now require or strongly recommend DFM checks for advanced nodes... < br/ > < br/ > View the full article < a href="http://www.eetimes.com/design/eda-design/4235844/Successful-Adoption-of-DFM" > HERE <

Embedded Solutions Day - Thursday 22nd March 2012 | PRLog
www.prlog.org | Feb 6, 2012
Embedded Solutions Day - Thursday 22nd March 2012. An essential one-day workshop for engineers considering a new design containing either an embedded PC or RISC processor. - PR11791151

3D TSV Test: ATE challenges and potential solutions
www.eetimes.com | Dec 29, 2011
3D TSV Test: ATE challenges and potential solutions

SVTC Technologies and SUSS MicroTec Partner to Accelerate Development of Wafer-Level Processing for
www.prweb.com | Nov 15, 2011
SVTC expands partnerships to support development options for 3D IC integrated solutions, bringing the latest bonding capabilities to customers.

LDSBandwidth - The ChipList 2
www.chiplist.com | Sep 22, 2011
LDSBandwidth: Measures the peak bandwidth of local memory using different access patterns.

RF Micro Devices, Inc. - RFMD(R) Announces Availability of New pHEMT Process Technologies for
ir.rfmd.com | Aug 8, 2011
RFMD announces availability of GaAs pHEMT process for foundry customers.

RUMOR: Apple could leave Samsung for chip production next year
www.mobileburn.com | Jun 27, 2011
The on-going court battle over patents and trade dress between Apple and Samsung could very well have a negative effect on Samsung's chip production business, as rumors are saying that Apple may be looking at other manufacturers to make its processors next year. Apple is Samsung's second largest

EEbeat › DOE offers $150 M to support breakthrough solar manufacturing process
www.eebeat.com | Jun 19, 2011
U.S. Energy Secretary Steven Chu today announced the offer of a conditional commitment for a $150 million loan guarantee to 1366 Technologies, for the development of a multicrystalline wafer manufacturing project. The project will be capable of producing approximately 700 to 1,000 MW of

TERIDIAN UNVEILS INDUSTRY’S FIRST ENERGY MEASUREMENT CHIP FOR DATA CENTER POWER DISTRIBUTION UNITS
pdfserv.maxim-ic.com | May 15, 2011
Maxim offers Teridian energy-measurement SoC inside LED ballast.