Semiconductor Packaging Press Releases

Press Releases

Four New Pavilions at NEPCON China 2012 to Shine Spotlight on Key Industry Issues | PRLog
www.prlog.org | Jan 10, 2012
Four New Pavilions at NEPCON China 2012 to Shine Spotlight on Key Industry Issues. Touch Screen Manufacturing, Advanced Electronics Packaging, Electronics Manufacturing Automation and ESD pavilions will be debuted at the 22nd edition of NEPCON China, which will be held from April 25-27, 2012. -

LTM8047 LTM8048 15W Isolated Low Noise DC DC microModule Converters Include Transformer :
www.electronicspecifier.com | Dec 12, 2011
Tiny 1.5W Isolated Low Noise DC/DC µModule Converters Include Transformer : Electronics News from Electronic Specifier

Press Release: Microsemi Expands SmartFusion cSoC Offering for Industrial and Military Applications
www.actel.com | Nov 15, 2011
New Leaded 208-PQFP Package Reduces PCB Manufacturing and Debugging Costs

SIP Forum Announces Dates for Second Annual SIPNOC – SIP Network Operators Conference – for
www.prweb.com | Nov 8, 2011
The two-day educational conference for service providers to be held in Herndon, VA, June 25-27, 2012; SIPNOC 2012 US early bird registration to begin in mid-November

GPS LNAs provide low noise and save space with a WLP package - New Product Release
www.maxim-ic.com | Feb 7, 2011
Maxim New Product Press Release for the MAX2686, MAX2688.

Amplifiers and Linear - Current Shunt Monitor - INA216A4 - TI.com
focus.ti.com | Dec 21, 2010
Download a datasheet or document on TI's INA216A4 Amplifiers and Linear, from the Current Shunt Monitor collection of analog and digital product folders.

SIP to transform mobile operators
www.mobileeurope.co.uk | Jun 23, 2010
SIP to transform mobile operatorsThe profitable generation of new service revenues is a key priority for mobile operators. Yet introducing new services, and blends of services, can look a daunting and expensive technical challenge, with the requirement for new call and session control technologies.

EEbeat › NXP shows smallness at Embedded Conference
www.eebeat.com | Apr 29, 2010
Over at booth 1508 at ESC, NXP Semiconductors showed off the tiny LPC1102 32-bit microcontroller with a 2 x 2 mm footprint. The WLCSP chip-scale packaged MCU is based on a Cortex-M0 and takes only 130 ua/MHz in full operation.This surely sets a record for processing power/mm squared. It includes a

Wafer Level Packaging is a confirmed high growth trend in the semiconductor packaging industry.
www.electronics.ca | Sep 28, 2009
Wafer Level Chip Scale Packaging (WLCSP), or the direct bonding of bumped integrated circuits (IC s) on printed circuit boards (PCB s) as one of the most visible expressions of WLP, is undoubtedly the fastest growing package type in the whole industry.

Digigram - What is SIP?
www.digigram.com | May 20, 2009
Digigram provides networking solutions for digital audio and remote management