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Agilent announces PSP model-extraction package
Agilent Technologies has announced what it calls the first complete and commercially available Pennsylvania State University-Philips (PSP) model parameter extraction package for advanced CMOS device models. The new package, for use with Agilent’s Integrated Circuit Characterization and Analysis
Measure Foundry works with all test instruments
Measure Foundry 5, formerly DT Measure Foundry, has expanded its I/O capabilities beyond Data Translation hardware. The software uses VISA to send commands to instruments such as digital multimeters (DMMs), oscilloscopes, function generators, spectrum analyzers, RF generators, and power supplies.
Metrology Tools
The VANGUARD Series Metrology Tools from Rudolph Technologies provide measurements for all process films. The MetaPULSE tool uses picosecond ultrasonic laser sonar (PULSE) to characterize metal films with sub-angstrom repeatability, and the SpectraLASER t
Sidense Supported Foundries - TSMC, SMIC, UMC, Fujitsu, GLOBALFOUNDRIES, ON Semi, Tower, Jazz
Fujitsu Microelectronics Limited (FML) is a large-scale integrated circuit (LSI) manufacturer that provides highly reliable, optimal solutions to meet various needs of customers, with perfect matches of business including ASIC, foundry, ASSP and power
Avago Technologies Extends Alliance with TSMC to include the next two generations of its
Avago Technologies Extends Alliance with TSMC to include the next two generations of its enhanced-performance image sensor products : Electronics News from Electronic Specifier
Global and China Wafer Foundry Industry Report, 2010
This report discusses the global and China wafer foundry industry for 2010
2010 IC Cost Model
IC Cost Model is designed to enable users to easily estimate manufacturing costs for most IC's
Image Sensors - Global Strategic Business Report
This report analyzes the worldwide markets for Image Sensors in US provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.
2010 IC Packaging Report
IC Packaging report describes the packaging market with key player profiles, the packaging materials market, package types and selection criteria, the packaging process, packaging technology trends, packaging costs and how to select and manage a packaging foundry
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