Products
Silicon-on-Insulator Wafers
The Advantox 150 is developed to provide high-quality SIMOX-SOI wafers for use in the manufacturing of complementary metal oxide semiconductor (CMOS) applications. The process increases the throughput of the company's 1000 implanters by ~250%, comp
Macrodefect Inspection System
The WaferView 320 Turbo macrodefect inspection tool can improve yield by offering ultrahigh-throughput inspection of the front, back and edge of wafers for lithography problems, providing the opportunity to rework and recover more wafers before they undergo subsequent irreversible processing steps.
Amorphous Carbon Wafers
These amorphous carbon wafers are an alternative to silicon for reference wafers and membrane thickness monitoring wafers. For example, UNIVEKS amorphous carbon wafers can last 50× longer than silicon wafers in acid etching because of their excelle
Amorphous Carbon Wafers
UNIVEKS amorphous carbon wafers are an alternative to silicon for reference wafers and membrane thickness monitoring wafers. They are high-purity, glass-like carbon wafers manufactured by injection molding a proprietary phenol resin followed by carboniz
MOCVD Grown Wafers
Custom and standard GaAs based metalorganic chemical vapor deposition (MOCVD) grown wafers are available for vertical cavity surface emitting lasers and laser arrays. These high-uniformity wafers are &0.2% in composition across 3 in.
Bumped Wafers Inspection System
The WS-1000 bumped wafer inspection system is designed for final inspection of bumped wafers used to produce chip-scale and flip-chip packaged ICs. The system uses 3D laser technology to provide non-contact measurements of bump height and co-planarity and
Bumped Wafers Inspection System
The WS-1000 bumped wafer inspection system is designed for final inspection of bumped wafers used to produce chip-scale and flip-chip packaged ICs. The system uses 3D laser technology to provide non-contact measurements of bump height and co-planarity and
WT-85 Lifetime Scanner
WT-85 Lifetime Scanner measures wafers and/or wafer fragments of any shape and size up to 300 mm. The scanner monitors defects and contamination in the bulk and surface region of silicon wafers. Available as a manual or automated system with cassette-to-c
Cleaning & Bonding System
CL200 cleaner/SOI bonder cleans, dries, aligns and bonds in one closed chamber with specific atmosphere. The system is designed for creating silicon-on-insulator (SOI) substrates for devices such as low-power and high-speed LSIs, smart sensors and smart
Silicon Carbide Dummy Wafers
Aegis SiC-CVD wafers are an alternative to silicon dummy or filler wafers. These wafers are made from an advanced CVD process and are said to be unaffected by HF and HNO 3 acids during cleaning. Its chemical stability provides an etch rate over 1000 times
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