Wafer Processing Products

Products

High-Purity Quartz
semiconductor.net | Jun 15, 2009
With versatility in shape, size, transparency and form, high-purity quartz solutions are provided in customized near-net shapes and complex welded assemblies. Known for their chemically resistant properties and their ability to withstand extremely high temperatures, quartz products come in a

CVD Vaporizer
semiconductor.net | Jun 15, 2003
Model 2800 vaporizer generates extremely high-purity source chemical vapor for CVD processes.

Sputter Deposition System
semiconductor.net | Jul 1, 2008
Apollo is a high-volume manufacturing tool designed for advanced wafer-level packaging. Three chambers under vacuum can operate in parallel, allowing three batches of wafers to be simultaneously processed. Apollo handles wafer sizes from 100 to 300 mm ranging in thickness from 100 μm to 2 mm.

Metal CVD System
semiconductor.net | Nov 1, 2006
Trias LT Ti/TiN is a 300 mm metal CVD system for the deposition of titanium and titanium nitride films in low-temperature process regimes. The system incorporates an enhanced shower head design to allow for wafer temperature control over a wide range of deposition temperatures. It improves barrier

Servo Motors
semiconductor.net | Mar 15, 2004
A family of non-magnetic ceramic servo motors provides precise motion control for wafer manufacturing processes. The servo motors have no magnetic materials and no EMI, eliminating any disturbance to e-beam and ion-beam processes. The motors are vacuum-compatible, rated for either high vacuum (10-7

PVD System
semiconductor.net | Dec 1, 2007
AKT-PiVot is a 55 kV PVD system for depositing metal and TCO materials on Gen 8.5 glass substrates. Its parallel processing capability eliminates bottlenecks caused by different process times for each film layer. The system's cluster-like arrangement also allows for continuous operation during

PVD System
semiconductor.net | Feb 1, 2003
Endura PVD CleanW system is for critical sub-100 nm polysilicon/metal gate and bit line applications. The system uses a single chamber to deposit a very thin, low-resistivity tungsten nitride/tungsten film stack as the transistor gate material, and reduces the thickness of the polysilicon/metal

CVD Trap
semiconductor.net | Jul 1, 1999
The HPS TEOS Mesh Trap is designed for use in TEOS-based low pressure chemical vapor deposition (CVD) systems. The trap stops byproducts before they reach the pump and contains the byproducts to prevent backstreaming.

CVD Hard Mask
semiconductor.net | Sep 1, 2008
Ashable hard mask (AHM) technology has been created to support the company's Vector Extreme system. The technology incorporates a number of unique RF power configurations, optimized process gas chemistry and integrated post-deposition edge bevel film removal for 45 nm and below. The system can

Deep Plasma Etching Tool
semiconductor.net | Apr 23, 2002
I-Speeder-AMS 200 ICP (inductively coupled plasma) deep etching tool is for high-volume production of MEMS and MOEMS. This cassette-to-cassette production tool consists of a single-wafer vacuum load-lock assembly connected to a processing chamber. This chamber is fitted with a high-density,