Semiconductor Packaging Products

Products

IC Handlers
semiconductor.net | Jul 1, 1998
NS-5000 Series is a high-speed, high-temperature IC handler. The package types that the system handles include QFP, BGA, PLCC, TSOP, SOP, PGA, CSP and µBGA. (Model NS-5040 is for quad test mode). Changeover can be done in &10 min with the one-touch cha

Flip-Chip Stepper
semiconductor.net | Feb 1, 2001
Prisma-ghi research and development (R&D) and pre-production flip-chip (bump) stepper integrates the company's broadband g-, h- and i-line exposure capabilities for bump and wafer-level packaging processing technology. It is designed for bump and wa

Wafer Bump Solution
semiconductor.net | Sep 1, 2005
These wafer bumping and ball placements solutions allow for single-stroke, unlimited bump quantity with bump height targets of 80-150 µm on pitches of 150-500 µm. Vortex is a cleanroom-compatible, paperless cleaning system, with fully enclosed print head technology that delivers high-quality paste

Polymer Films
semiconductor.net | Oct 15, 2005
Microlithographic polymer films for semiconductor packaging applications provide advanced negative working photoresist formulations for excellent productivity, smaller environmental footprint, simple processing and high yields. The films allow for solvent-free, aqueous-based developer and remover

Microelectronics Dispensing System
semiconductor.net | Sep 15, 2000
Millennium M-2020 dispensing system provides high-speed and highly accurate dispensing for demanding microelectronics applications for semiconductor package and board assembly. It dispenses a wide range of encapsulants, adhesives and thermal compounds

BGA Package
semiconductor.net | Jun 16, 2001
The etCSP package is a BGA with an extremely thin, 0.5 mm mounted height, fitting into applications requiring a thin form factor. The package consists of one or two peripheral rows of 0.3 mm solder balls for SMT processing. SEMICON West Booth 10742-SJ

Stacked Die Design Software
semiconductor.net | Jul 13, 2000
Stacked Die Designer software is a complete IC packaging design system for state-of-the-art packages. It uses interfaces and a single button approach to design. The tool automates the design process for any type of stacked-die semiconductor package. All

Wafer Bumping System
semiconductor.net | Oct 1, 2001
This wafer bumping system with integrated ProFlow DirEKt automated wafer handler can apply many different alloys or advanced materials such as adhesive epoxies. The system provides consistent filling of apertures, improves gasketing between the stencil and wafer and enhances controls over print

Packaging Polymers
semiconductor.net | Mar 15, 2004
A new family of liquid crystal polymers (LCPs) is capable of producing hermetic plastic packages. Independent testing based on JEDEC and MILspecs confirms that this specially formulated LCP meets the current and future performance requirements for packaging semiconductor devices. By combining the

CSP Adhesive
semiconductor.net | Jan 1, 2002
Loctite CornerBond 3515 is an adhesive that provides the reliability of traditional capillary flow underfills with improved shock resistance and device reliability for CSP and BGA assemblies. It offers simplified applications and faster processing than traditional underfills. The adhesive is