May 19, 2009: IPC White Paper Examines the Myths and Facts of HDI Technology for North American Manufacturers

Whitepaper  |  www.ipc.org | Jul 21, 2009

BANNOCKBURN, Ill., USA, May 19, 2009 — IPC — IPC — Association Connecting Electronics Industries® has released a new white paper, An Executive Overview of HDI The Reality of HDI: Fact vs.

http://www.ipc.org/ContentPage.aspx?pageid=IPC-White-Paper-Examines-the-Myths-and-Facts-of-HDI-Technology-for-North-American-Manufacturers

Microwave Engineering Online - Encyclopedia

It uses a carbon membrane that absorbs oxygen, a zinc plate and potassium hydroxide as the electrolyte. The technology dates back to the 1920s, when large batteries were used for remote railroad switches and lights on harbor buoys.

http://www.mwee.com/encyclopedia/defineterm.jhtml?term=zincair

UNOVIS SOLUTIONS

Resource  |  it.zibb.com

Unovis Solutions ǂ Unovis Solutions® is a registered trademark used for Electronics Assembly Machines That Complement and Enhance Standard Surface Mount Equipment For the Automotive, Component Assembly, Telecommunications, and Medical Markets, Namely, Semiconductor Manufacturing Machines, Component

http://it.zibb.com/trademark/unovis+solutions/30188949

Minco Offers Free Basics of Flex Circuit Design White Paper

Whitepaper  |  www.pcb007.com | Sep 30, 2009

This paper will introduce you to the reasons to consider flex circuits. They are light, compact, robust, and resilient, and ideal for today's smaller and more portable electronics.

http://www.pcb007.com/pages/zone.cgi?a=53481

Provide Feedback for the TechWeb Digital Library

Geek-Speak Glossary: A Manager's Guide to IT Terminology The rapidly changing pace of the IT industry has lead to the creation of hundreds of acronyms and terms virtually overnight. The Geek-Speak Glossary provides definitions for over 300 of the most commonly used IT terms.

http://www.informationweek.com/whitepaper/feedBack.jhtml?previousLink=http%3A//www.informationweek.com/whitepaper/Hardware/Macintosh

With the introduction of Leadfree solder, voiding within Ball Grid Array (BGA) joints is...

Whitepaper  |  www.tmworld.com

With the introduction of Leadfree solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue during Printed Circuit Board Assembly (PCBA) manufacture.

http://www.tmworld.com/file/4161-white_paper.pdf

Getting Started in HDI Fabrication

Whitepaper  |  www.techonline.com | Jan 26, 2008

High-density interconnect (HDI) fabrication is the fastest growing segment of the printed circuit industry HDI/microvia technologies are the printed circuit board (PCB) architectures of the future. Smaller component pitches, larger application specific integrated circuits (ASICS) and field

http://www.techonline.com/learning/techpaper/205918887

Green SupplyLine

Get the latest news, updates, and how-to information on RoHS and WEEE. Sign up for the Green SupplyLine newsletter, a weekly e-mail guide to information on global environmental standards. Here is our RSS feed.

http://www.greensupplyline.com/encyclopedia/defineterm.jhtml?term=ISO+9660

Protecting Valuable Multimedia Content - Broadcastpapers.com

Multimedia business on the Internet will not take off until it carries valuable content. Valuable content will not be made available until rightsâ holders can be assured that their rights will not be abused.

http://www.broadcastpapers.com/whitepapers/Protecting-Valuable-Multimedia-Content.cfm?objid=32&pid=327&fromCategory=38

Nanotechnology Research – Laboratories and Institutes

Acreo, a contract R&D lab, deals with several aspects of optical components and systems for various applications. The company develops and manufactures new components or materials with new properties based on semiconductor structures in the nanometer scale.

http://www.nanowerk.com/nanotechnology/research/laboratories_a.php?page=1