Video
TechOnline | BGA Package Crosstalk in Depth
In this webcast from Xilinx, Dr. Howard Johnson, renowned SI expert, discusses the latest innovations to minimize signal integrity problems. Learn how Virtex-4 advanced packaging helps you achieve br
TechOnline | MMIC/RFIC Packaging Challenges
RFIC / MMIC design does not end when the chip layout is complete. Integration of the IC with the module and package (and even the system board) is a huge challenge, and becoming more difficult with the emergence of multi-chip RF modules, and with stacked-die RF modules on the horizon. When
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