Whitepapers
TechOnline | Innovative Solutions to Overcome the Challenges of Heat Management in the Data Center
According to the EPA's Report to Congress on Server and Data Center Energy Efficiency, if current trends continue, the demand for power by data centers will require an additional 10 power plants on the North American power grid by 2011.
element14: White Paper- Avago- Thermal Management For LED Applications
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IBM Redbooks | IBM j-type Ethernet Appliance Implementation
New challenges require a new network. An IBM®-architected data center running on Junos software is the foundation for that new network.
Power whitepaper FINAL 0206JDM.PDF
120 Post Road West, Suite 201, Westport, CT 06880 Phone: 203-429-8950 Fax: 203-429-8930 © Robert Frances Group, Confidential 2006 1 The Rise to Power of… Power: Dealing with the new Data Center Constraint Jerald Murphy Senior Vice President and Service Director Robert Frances Group 120 Post Road
LEDs Magazine - WHITE PAPER: Liquid-Forged LED heat sinks offer thermal advantages
Aluminum heat sinks manufactured by a liquid-forging process offer a number of heat-transfer advantages in comparison to products manufactured by competing techniques, according to Exploit Technologies.
Product Information
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TechOnline | Platform Thermal Management
Advances in technologies are driving integration of more features and higher performance into smaller chip designs that is resulting in higher power and density. High power and density pose significant cooling challenges for system design as well as the facility housing the equipment.
TechOnline | Optimizing FPGA Power with ISE Design Tools
In the more than twenty years since Xilinx invented the field programmable gate array (FPGA), research and development have produced dramatic improvements in FPGA speed and area efficiency, narrowing the gap between FPGAs and ASICs and making FPGAs the platform of choice for implementing digital
TechOnline | PCB-Level Component Thermal Management with Fixed Price, All-Inclusive Heat Sink
Thermal management is the cornerstone of a successful product launch. Yet it often takes a back seat to other project parameters due to either lack of resources or available time.
TechOnline | Verizon NEBS Compliance: Thermal Management Requirements for Improved Energy
Thermal management for improved energy efficiency and reliability of electronic equipment is applicable during the design phase at the device, printed board assembly (PBA), shelf and system level.
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