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TechOnline | Leveraging FPGA in PCB System Designs: Optimizing Profit Margin

Any design project that leverages field programmable gate arrays (FPGAs) to implement system designs has the opportunity to: reduce total design cycle time by as much as fifty percent; minimize printed circuit board (PCB) manufacturing costs; and optimize product profit margin. This white paper

TechOnline | PowerPAD Thermally Enhanced Package

The PowerPAD thermally enhanced package provides greater design flexibility and increased thermal efficiency in a standard size device package. PowerPAD's improved performance permits higher clock speeds, more compact systems and more aggressive design criteria. PowerPAD packages are available in

TechOnline | Multilayer Lamination Methods for PTFE-based PCBs

Teflon (PTFE) microwave laminates are increasingly being used in both RF and digital designs. Higher frequencies and data rates require material with a very low electrical loss, consistent dielectric constant, and tight thickness tolerance. PTFE laminates have all of these characteristics and offer

TechOnline | Fundamentals of PCB Manufacturing

This paper provides a description of the PCB manufacturing process with respect to the Systems Manufacturing Solutions (SMS) product portfolio of the Systems Design Division (SDD). This is the process of taking the bare PCB and adding the various components to it to create an operational PCB.

TechOnline

TechOnline delivers e-learning solutions and resources to the electronics community. E-Learning and technical resources for the electronics community, including: on-line training courses, web broadcasts, product labs, and more. Content for analog, DSP, electronic design automation, embedded

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