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Assembly & Manufacturing
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Printed Circuit Board Assembly PCB assembly PCB Design PCB Layout Technical Resources
Transport (Process) Rails - Most PCB Assembly equipment (surface mount placement machines, reflow ovens, wave solder machines, precision coaters) require an area on the edges of the board that is free of components or leads.
With the introduction of Leadfree solder, voiding within Ball Grid Array (BGA) joints is...
Whitepaper | www.tmworld.com
With the introduction of Leadfree solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue during Printed Circuit Board Assembly (PCBA) manufacture.
ESD Journal - IC's
Much effort has been put into characterizing the impact of electrostatic discharge (ESD) on individual integrated circuits (ICs)and on completed equipment such as computers. However, less time has been spent characterizing the ESD threat to ICs mounted on printed circuit boards (PCBs).
ESD Journal - Auditing For Static Safety
Assuring proper use involves two strategies: first, management follow-up, supervision, and training; and second, frequent static-control audits designed to spot unsuspected sources of charge buildup and ESD. In the article that follows, Al Boucher shares the findings of such an audit.
ESD Journal - Static Controls Pays
The return on investment (ROI) in static control may be one of management's best investments. ESD control programs benefit the bottom line dramatically, even when redundant control strategies are included.
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