Solution for USB 2.0 Short Circuit Stress Test with Pericom's PI3USB10LP-A/102

Whitepaper  |  www.techonline.com | May 14, 2008

Pericom's PI3USB10LP-A and PI3USB102 USB switches are small package, low I/O capacitance, and low R-on single differential channel 2:1 multiplexer/demultiplexer USB 2.0 solutions. These traits are ideal for Universal Serial Bus (USB) applications, and both products demonstrate excellent signal

http://www.techonline.com/learning/techpaper/207602603

Environmental Chamber Controls: A White Paper

With the explosive growth in the electronics marketplace and the realization of a global economy the pace of change in electronics is rapidly becoming difficult to manage; product development cycles are becoming compressed in time.

http://www.tidaleng.com/vtvpaper.htm

con_app_081009

Whitepaper  |  www.tycoelectronics.com

Problems associated with testing of connectors for nanosecond intermittency are summarized. Methods are described that provide a practical and reliable approach to nanosecond intermittency testing of connectors. INTRODUCTION

http://www.tycoelectronics.com/documentation/whitepapers/pdf/5jot_8.pdf

Technical Papers - ESD Journal

Abbreviation of Electrostatic Discharge - In this paper consequences of improper use of the abbreviation are considered and consistent practice for the written and spoken language are proposed - by Toni Viheriakoski, Specialist, Electrostatics, Nokia Siemens Networks (pdf)

http://www.esdjournal.com/techpapr/techpaps.htm

USA Wire & Cable

Early URD cables were made up with a semi-conducting tape over the insulation and concentric wires applied around this taped core. It is apparent that there would be concern as to whether fabric tapes would hold up without deterioration.

http://www.usawire-cable.com/techpapers/extruded_insul.asp

T/Mon NOC Protocols and devices - Page 1

53101 - DPS Telecom · 4955 E. Yale Ave., Fresno, CA 93727-1523 Sales: (800) 693-0351 · Fax: (559) 454-1688 · E-Mail: info@dpstele.com © Copyright 2008 DPS Telecom. All rights reserved.

http://www.dpstelecom.com/white-papers/snmp-transition/tmon_supported_devices.php

Solid State Technology - Introducing Pulsing into Reliability Tests for Advanced CMOS Technologies

Introducing Pulsing into Reliability Tests for Advanced CMOS Technologies AC, pulsed stress is a useful addition to the typical stress-measure tests for investigating both semiconductor charge trapping and degradation behaviors.

http://sst.pennnet.com/whitepapers/wp.cfm?id=1344

Literature Library for Brochures, Manuals, White Papers, & Case Studies on Materials Testing

This issue includes technical tips on "Indicating the Correct Gauge Length for Your Specimen" and "Using Grips in a Low-Temperature Chamber". The QA is on losing power during testing.

http://www.instron.com/wa/library/default.aspx?d=15

ESD Journal - A thoughtful Approach

Exceptional care must often be taken to protect personnel and ESD-sensitive parts from the consequences of improper grounding. To help deal with grounding problems in the field, here is advice form a member of the ESO/ESD Grounding Standards Committee.

http://www.esdjournal.com/techpapr/eosesd/grounds/fsg.htm

ESD Journal - Floor Materials

Floor Testing Series: This is the first in a series of two articles describing a possible test methodology for flooring materials. This method involves procedures for testing electrical resistance, body voltage generation, body voltage decay, voltage gradient, and voltage suppression.

http://www.esdjournal.com/techpapr/eosesd/floor/floortst.htm