The base SDIO controller supports SD, SDHC, and MMC memory cards with 4-bit and 8-bit widths. The enhanced design includes multi-drive control logic and a multiplexer to connect the controller to multiple cards using a single set of I/O lines. Cards can be of any capacity to as large as the 32 Gbytes that the SD 2.0 specification allows. Mr. Heape pointed out that this would permit a four-card implementation to give a portable device up to 128 Gbytes of storage, comparable to mini hard drives but with the reliability and flexibility advantages of removable solid state memory.

Because the controller treats each card slot as an independent solid state drive, users can mix card types and capacities in the slots without restriction. The controller can work with multiple cards as described, or can work with SD-based Managed NAND devices (such as Sandisk's iNAND) and work with embedded MMC (eMMC) devices such as Samsung's MoviNAND. It senses the type and capacity of a card (or attached memory device) upon insertion (or power-up) and automatically configures its operation to match. The controller can also be modified so that one card or attached memory device can be designated as the "boot" device in a system. Software driver support for Linux, Windows CE, and Windows Mobile operating systems is available.

Availability

QuickLogic's enhanced SDIO host controller PSB is available immediately in a 4-slot configuration and can be customized for other configurations as needed. The PSB can be implemented in the programmable fabric in the PolarPro and EclipseII CSSP platforms or can augment the base SDIO controller built into the ArcticLink CSSP family to provide multi-slot operation. Contact QuickLogic for additional information on the multi-slot SDIO controller PSB and the CSSP platform design approach.

About QuickLogic

QuickLogic Corporation (NASDAQ:QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.

(C)2008 QuickLogic Corporation. All rights reserved.

QuickLogic is a registered trademark, and the QuickLogic logo is a trademark of QuickLogic. Other trademarks are the property of their respective companies.

SOURCE: QuickLogic Corporation

QuickLogic Corporation
Andrea Vedanayagam, 408-990-4000
Director, Corporate Communications
andrea@quicklogic.com

WLCSP eliminates the area overhead of conventional BGA packaging and it is done with a standard die by fabricating an additional metal redistribution layer to re-route the I/O lines from the perimeter bonding pads to an array. It then "bumps" (adds solder balls to) the array, making it ready for customers to use in conventional surface-mount fabrication processes.

Availability

The WLCSP packaging option is immediately available for QuickLogic's ArcticLink CSSP platform family.

About QuickLogic

QuickLogic Corporation (NASDAQ:QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.

(C)2008 QuickLogic Corporation. All rights reserved.

QuickLogic is a registered trademark, and the QuickLogic logo is a trademark of QuickLogic. Other trademarks are the property of their respective companies.

Code: QUIK-G

SOURCE: QuickLogic Corporation

QuickLogic Corporation
Andrea Vedanayagam, 408-990-4000
Director, Corporate Communications
andrea@quicklogic.com

Itzhak Edrei, senior vice president for worldwide product lines and sales at Tower Semiconductor, said: "QuickLogic's high-quality of products is to be complemented by Tower's excellence in engineering and manufacturing execution, and we expect our volumes to reflect the rapid growth path forecasted for this market segment."

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QuickLogic said it has reduced its headcount by 17% and is saving more than 25% in total non-GAAP operational costs. The company will record non-cash impairment charges of $1.8 million to $2.4 million and one-time cash charges of approximately $500,000 by the end of the third quarter of 2008.

Thomas Hart, chairman, president and CEO of QuickLogic, said: "We believe this operational alignment will accomplish a number of objectives important to both our future growth and the interests of our stockholders. We have lowered our fixed engineering costs, creating a larger variable cost budget for specialized design support. This change allows us to more quickly address the opportunities presented by our target customers by leveraging the diverse analog and digital design talent available around the world."

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Republication or redistribution, including by framing or similar means,
is expressly prohibited without prior written consent. Datamonitor shall 
not be liable for errors or delays in the content, or for any actions 
taken in reliance thereon