<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/"><channel><title>Zibb.com: Packaging Equipment (Industry News &amp; Blogs)</title><link>http://www.zibb.com/electronics/theme/p/Packaging+Equipment</link><atom:link rel="self" type="application/rss+xml" href="http://www.zibb.com/electronics/theme/p/Packaging+Equipment" /><description>
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				</language><webMaster>search@zibb.com (RB Search)</webMaster><copyright>Copyright (c) 2007 Reed Business Information. All rights reserved.</copyright><pubDate>Fri, 20 Nov 2009 17:00:00 GMT</pubDate><lastBuildDate>Fri, 20 Nov 2009 17:00:00 GMT</lastBuildDate><ttl>60</ttl><image><title>Zibb.com: Packaging Equipment (Industry News &amp; Blogs)
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					</url></image><item><title>Applied-Semitool deal: What analysts are saying</title><link>http://www.eetimes.com/news/semi/rss/showArticle.jhtml?articleID=221900486&amp;cid=RSSfeed_eetimes_semiRSS</link><description>...technological challenge for packaging houses, and it will be an inflection point leading to strong growth in the packaging equipment market over the next few years. We believe the acquisition of Semitool enables Applied to offer a completed...</description><guid>http://www.eetimes.com/news/semi/rss/showArticle.jhtml?articleID=221900486&amp;cid=RSSfeed_eetimes_semiRSS</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 20 Nov 2009 17:00:00 GMT</pubDate><source url="http://www.eetimes.com" /></item><item><title>Kulicke &amp; Soffa FY Q4 Tops Estimates, But Stock Tumbles (at Barro...
      </title><link>http://blogs.barrons.com/techtraderdaily/2009/11/19/kulicke-soffa-fy-q4-tops-estimates-but-stock-tumbles/?mod=yahoobarrons</link><description>...was likewise well ahead of the Street at 4 cents. But apparently, guidance from the producer of semiconductor packaging equipment was not as good as the Street had hoped: the company sees FY Q1 revenue of $115 million to $120 million...</description><guid>http://blogs.barrons.com/techtraderdaily/2009/11/19/kulicke-soffa-fy-q4-tops-estimates-but-stock-tumbles/?mod=yahoobarrons</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Thu, 19 Nov 2009 16:36:21 GMT</pubDate><source url="http://blogs.barrons.com" /></item><item><title>SEMATECH Symposia Reveal Continuing Momentum in EUVL and 193 nm I...
      </title><link>http://nanotechwire.com/news.asp?nid=8940</link><description>...Transistor Noise: Accelerates Development of Advanced Device Processing - SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege - SEMATECH and Shin-Etsu Chemical Company Partner at the UAlbany...</description><guid>http://nanotechwire.com/news.asp?nid=8940</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 13 Nov 2009 05:17:46 GMT</pubDate><source url="http://nanotechwire.com" /></item><item><title>Robotic Case PackerPalletizer Cell occupies 16 x 9 ft area., ESS ...
      </title><link>http://news.thomasnet.com/fullstory/568356</link><description>...suppliers of Robotic Case Packaging Equipment Robotic Palletizers ...Material ... more Schneider Packaging Equipment Co., Inc. Manufacturer...Distributor of material handling &amp; packaging equipment for cosmetics, pharmaceutical...</description><guid>http://news.thomasnet.com/fullstory/568356</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Wed, 11 Nov 2009 08:39:26 GMT</pubDate><source url="http://news.thomasnet.com" /></item><item><title>Diodes Inc. Q3 2009 Earnings Call Transcript (at Seeking Alpha)</title><link>http://seekingalpha.com/article/170689-diodes-inc-q3-2009-earnings-call-transcript?source=yahoo</link><description>...UBS Yes, and just one quick follow up there. So, the longer lead time that you are seeing for back-end packaging equipment, what is the approximate lead time currently? Keh-Shew Lu About 3 months. Stephen Chin – UBS Okay...</description><guid>http://seekingalpha.com/article/170689-diodes-inc-q3-2009-earnings-call-transcript?source=yahoo</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Tue, 03 Nov 2009 04:25:17 GMT</pubDate><source url="http://seekingalpha.com" /></item><item><title>Knockoffs Move beyond Gucci Bags</title><link>http://www.designnews.com/article/388509-Knockoffs_Move_beyond_Gucci_Bags.php?rssid=20055</link><description>...if it did not have to compete with copies of its own products. Italian manufacturers Marchesini, a maker of packaging equipment, and Ronchi, which specializes in high-speed filling machines, say they too have seen copies of their equipment...</description><guid>http://www.designnews.com/article/388509-Knockoffs_Move_beyond_Gucci_Bags.php?rssid=20055</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Sun, 01 Nov 2009 05:00:00 GMT</pubDate><source url="http://www.designnews.com" /></item><item><title>Advanced Semiconductor Engineering, Inc. Reports Unaudited Consol...
      </title><link>http://www.prnewswire.com/news-releases/advanced-semiconductor-engineering-inc-reports-unaudited-consolidated-financial-results-for-the-third-quarter-of-2009-67467877.html</link><description>...million was used for wirebonding packaging capacity and US$20 million was used for wafer bumping and flip chip packaging equipment. * As of Sep 30, 2009, there were 8,880 wirebonders in operation. 391 wirebonders were added and 12 wirebonders...</description><guid>http://www.prnewswire.com/news-releases/advanced-semiconductor-engineering-inc-reports-unaudited-consolidated-financial-results-for-the-third-quarter-of-2009-67467877.html</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 30 Oct 2009 06:15:00 GMT</pubDate><source url="http://www.prnewswire.com" /></item><item><title>Advanced Semiconductor Engineering, Inc. Reports Unaudited Consol...
      </title><link>http://finance.yahoo.com/news/Advanced-Semiconductor-prnews-3965632097.html?x=0&amp;.v=79</link><description>...million was used for wirebonding packaging capacity and US$20 million was used for wafer bumping and flip chip packaging equipment. * As of Sep 30, 2009, there were 8,880 wirebonders in operation. 391 wirebonders were added and 12 wirebonders...</description><guid>http://finance.yahoo.com/news/Advanced-Semiconductor-prnews-3965632097.html?x=0&amp;.v=79</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 30 Oct 2009 06:15:00 GMT</pubDate><source url="http://finance.yahoo.com" /></item><item><title>Advanced Semiconductor Engineering, Inc. Reports Unaudited Consol...
      </title><link>http://www.zibb.com/article/5630846/Advanced+Semiconductor+Engineering+Inc+Reports+Unaudited+Consolidated+Financial+Results+for+the+Third+Quarter+of</link><description>...million was used for wirebonding packaging capacity and US$20 million was used for wafer bumping and flip chip packaging equipment. * As of Sep 30, 2009, there were 8,880 wirebonders in operation. 391 wirebonders were added and 12 wirebonders...</description><guid>http://www.zibb.com/article/5630846/Advanced+Semiconductor+Engineering+Inc+Reports+Unaudited+Consolidated+Financial+Results+for+the+Third+Quarter+of</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 30 Oct 2009 02:15:00 GMT</pubDate><source url="http://www.zibb.com" /></item><item><title>Renesas to exit back-end IC equipment business</title><link>http://www.fabtech.org/news/_a/renesas_to_exit_back-end_ic_equipment_business/</link><description>...Materials sees higher CapEx spending for 2009 - 15 August 2008 Renesas Technology is to transfer its back-end IC packaging equipment manufacturing arm to Hitachi High-Technologies. Renesas Eastern Japan Semiconductor had revenue of 6...</description><guid>http://www.fabtech.org/news/_a/renesas_to_exit_back-end_ic_equipment_business/</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Wed, 28 Oct 2009 11:57:37 GMT</pubDate><source url="http://www.fabtech.org" /></item><item><title>I-Micronews - ADVANCED PACKAGING: 3D IC, WLP &amp; TSV : More on VisE...
      </title><link>http://www.i-micronews.com/lectureArticle.asp?id=3647</link><description>...VisEra makes use of surplus production capability for LED packaging to save the vast capex required by wafer level packaging equipment, creating a high entry barrier for its followers. The solid state lighting industry not only runs on large...</description><guid>http://www.i-micronews.com/lectureArticle.asp?id=3647</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Wed, 21 Oct 2009 11:35:00 GMT</pubDate><source url="http://www.i-micronews.com" /></item><item><title>Exclusive Interview with VisEra’s CEO J.J. Lin: Wafer Level Silic...
      </title><link>http://www.ledinside.com/interview_VisEra_20091021_en</link><description>...VisEra makes use of surplus production capability for LED packaging to save the vast capex required by wafer level packaging equipment, creating a high entry barrier for its followers. The solid state lighting industry not only runs on...</description><guid>http://www.ledinside.com/interview_VisEra_20091021_en</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Wed, 21 Oct 2009 01:48:14 GMT</pubDate><source url="http://www.ledinside.com" /></item><item><title>Sealed Air "Pick and Pack Packaging Automation for Everyone" to B...
      </title><link>http://www.prweb.com/releases/packaging-automation/pack-expo-sealed-air/prweb2852164.htm</link><description>...U3F1YS1TcXVhLUhhbGYtVGhpci1Ib3JyLUNvdXAtWmVybw== Technorati Tags packaging automation pick and pack packaging automation packaging equipment tray forming equipment sustainable packaging sealed air protective packaging Bookmark - Del.icio.us | Furl...</description><guid>http://www.prweb.com/releases/packaging-automation/pack-expo-sealed-air/prweb2852164.htm</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Tue, 15 Sep 2009 02:49:26 GMT</pubDate><source url="http://www.prweb.com" /></item><item><title>TAITRONICS set to open</title><link>http://www.electroline.com.au/news/35447-TAITRONICS-set-to-open</link><description>...featured. Exhibitors include high-precision card reader and RFID smart card manufacturer Asia Smart Tag, RFID packaging equipment supplier Highlight Tech and the Industrial Technology Research Institute’s Identification and Security Technology...</description><guid>http://www.electroline.com.au/news/35447-TAITRONICS-set-to-open</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Mon, 14 Sep 2009 03:22:20 GMT</pubDate><source url="http://www.electroline.com.au" /></item><item><title>Siemens to Showcase Joint PLM and Production Systems Solutions fo...
      </title><link>http://www.businesswire.com/portal/site/home/permalink/?ndmViewId=news_view&amp;newsId=20090908005251&amp;newsLang=en</link><description>...printing and electronic manufacturing as well as solutions for glass, wood, plastic, ceramic, textile and packaging equipment and crane systems. The services provided by the Division include mechatronics support in addition to online...</description><guid>http://www.businesswire.com/portal/site/home/permalink/?ndmViewId=news_view&amp;newsId=20090908005251&amp;newsLang=en</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Tue, 08 Sep 2009 21:57:49 GMT</pubDate><source url="http://www.businesswire.com" /></item><item><title>Nanogate Launches Strategic Cooperation with Specialist Nanotechn...
      </title><link>http://www.nanowerk.com/news/newsid=12476.php</link><description>...Level Solutions in Asia With Anglia Partnership Posted: Sep 1st, 2009 SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH Posted: Sep 1st, 2009 ...more nanotechnology business news News &gt; Nanowerk Business...</description><guid>http://www.nanowerk.com/news/newsid=12476.php</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 04 Sep 2009 21:22:47 GMT</pubDate><source url="http://www.nanowerk.com" /></item><item><title>Cloud Packaging Solutions Grows via Acquisition</title><link>http://www.rdmag.com/News/Feeds/2009/09/materials-cloud-packaging-solutions-grows-via-acquisition/</link><description>...industrial, OTC &amp; Rx pharmaceutical and personal care industries. Cloud also designs and manufactures high-speed packaging equipment, developing cutting edge solutions for packaging machinery based on continuous-motion horizontal form-fill...</description><guid>http://www.rdmag.com/News/Feeds/2009/09/materials-cloud-packaging-solutions-grows-via-acquisition/</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 04 Sep 2009 05:32:16 GMT</pubDate><source url="http://www.rdmag.com" /></item><item><title>eBay Sells 65% of Skype</title><link>http://wireless.sys-con.com/node/1090513</link><description>...London Headquarters Surgient Uses Isilon IQ to Power Virtual Data Center SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege Aircraft Reports Material Expansion and Staff Increase Oracle...</description><guid>http://wireless.sys-con.com/node/1090513</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Tue, 01 Sep 2009 16:38:00 GMT</pubDate><source url="http://wireless.sys-con.com" /></item><item><title>Techniques to Build Energy-Efficient and Sustainable Machines</title><link>http://machinedesign.com/article/techniques-to-build-energy-efficient-and-sustainable-machines-0721</link><description>...And there may be unexpected side benefits as well. For example, a Rockwell Automation customer that makes OEM packaging equipment not only saved energy by switching from a single line shaft to individual drives, but also tightened manufacturing...</description><guid>http://machinedesign.com/article/techniques-to-build-energy-efficient-and-sustainable-machines-0721</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 21 Aug 2009 00:53:16 GMT</pubDate><source url="http://machinedesign.com" /></item><item><title>Dow Corning Develops Green Materials in China</title><link>http://www.circuitree.com/Articles/Breaking_News/7ad5a4f492e1a010VgnVCM100000f932a8c0____</link><description>...materials solution. As part of the program, Dow Corning’s team collaborated with local dispensing, measurement and packaging equipment suppliers in the South China region to integrate the new material into the customer’s manufacturing process...</description><guid>http://www.circuitree.com/Articles/Breaking_News/7ad5a4f492e1a010VgnVCM100000f932a8c0____</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Wed, 19 Aug 2009 08:44:53 GMT</pubDate><source url="http://www.circuitree.com" /></item><item><title>Advanced Semiconductor Engineering, Inc. Reports Unaudited Consol...
      </title><link>http://news.prnewswire.com/ViewContent.aspx?ACCT=109&amp;STORY=/www/story/07-31-2009/0005069565&amp;EDATE=</link><description>...million was used for wirebonding packaging capacity and US$6 million was used for wafer bumping and flip chip packaging equipment. -- As of June 30, 2009, there were 8,501 wirebonders in operation. 181 wirebonders were added and 99 wirebonders...</description><guid>http://news.prnewswire.com/ViewContent.aspx?ACCT=109&amp;STORY=/www/story/07-31-2009/0005069565&amp;EDATE=</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 31 Jul 2009 06:00:00 GMT</pubDate><source url="http://news.prnewswire.com" /></item><item><title>Packaging material supplier Laser Tek to see 30% sales growth in ...
      </title><link>http://www.digitimes.com/news/a20090724PD216.html</link><description>...revenues sales semiconductor semiconductor equipment supplier Related stories All Ring Tech to rely on LED packaging equipment for revenue growth (Jul 21) Taiwan passive component makers to enjoy growth throughout 3Q09 (Jul 10) ...</description><guid>http://www.digitimes.com/news/a20090724PD216.html</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Wed, 29 Jul 2009 07:54:06 GMT</pubDate><source url="http://www.digitimes.com" /></item><item><title>SEMI announces mid-year consensus forecast for chip equipment ind...
      </title><link>http://www.emsnow.com/npps/story.cfm?pg=story&amp;id=40078</link><description>...expected to decline 53 percent in 2009 to $10.42 billion. The forecast predicts that the market for assembly and packaging equipment will decline by 53 percent to $958 million in 2009. The market for semiconductor test equipment is forecasted...</description><guid>http://www.emsnow.com/npps/story.cfm?pg=story&amp;id=40078</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Mon, 20 Jul 2009 00:00:00 GMT</pubDate><source url="http://www.emsnow.com" /></item><item><title>CES introduces Shapenest CAD/CAM software tool (Manufacturingtalk...
      </title><link>http://www.manufacturingtalk.com/news/ccu/ccu101.html</link><description>...Pharmaceutical/medical manufacturing: production equipment (64) Pharmaceutical manufacturing: handling and packaging equipment (48) Pharmaceutical manufacturing: production software (4) Cosmetics manufacturing: packaging and dispensing...</description><guid>http://www.manufacturingtalk.com/news/ccu/ccu101.html</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Fri, 10 Jul 2009 13:42:47 GMT</pubDate><source url="http://www.manufacturingtalk.com" /></item><item><title>Bosch Rexroth automates KHS poucher</title><link>http://www.automation.com/pdf_articles/Rexroth_KHS_Poucher.pdf</link><description>...packaging option. KHS and Rexroth team up to create packaging solutions A leading global supplier of filling and packaging equipment for the beverage, food and non-food and drive amplifier into a compact but highly functional drive unit...</description><guid>http://www.automation.com/pdf_articles/Rexroth_KHS_Poucher.pdf</guid><category domain="http://www.zibb.com">Packaging Equipment</category><pubDate>Tue, 07 Jul 2009 05:17:22 GMT</pubDate><source url="http://www.automation.com" /></item></channel></rss>