Flip Chips

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Flip Chip Assembly

Engent provides Next Generation Assembly Services for Flip Chip

www.engentaat.com

Flip Chip Assembly

Package Design and Manufacturing From Prototype to Production

www.firstlevelinc.com

Companies listed for Flip Chips

ChipPAC,Inc.

Fremont, CA
US (United States)

ChipPAC,Inc. in Fremont, CA, US (United States) - Assembly Services, Design Services, Flip Chips, Printed Circuit Testing Services, Application Specific Integrated Circuit (ASIC) Semiconductor Design Engineers, Semiconductor Materials to Specification, Tin Lead Alloy, External Lead Finishing,

TEL: +510 979 8000    FAX: +510 979 8001
http://www.chippac.com

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Company location:

 

EuroAsia Semiconductor


Pac Tech Packaging Technology GmbH, founded 1995, in Nauen, Germany, is the world s leading wafer bumping and packaging subcontractor, specializing in electroless nickel under-bump metallization and solder-ball placement. The Company Pac Tech is divided into two unique business units.

 

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News and Blogs

Total : 238 View more »

FINETECH to Display High Accuracy Die Bonder at IMAPS 2008

www.pcb007.com | Oct 30, 2008

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER Lambda in booth 210 at the upcoming IMAPS 2008, November 2-6, 2008, at the Rhode Island Convention Center, in Providence, Rhode Island.

http://www.pcb007.com/pages/zone.cgi?a=46146

Test Research Inc. Brings AXI to Globaltronics

www.emsnow.com | Sep 8, 2008

New AOI, SPI and In-Circuit Tester Models Will Also Be Shown Test Research Inc. (TRI, TAIEX 3030) announced that it would showcase the new TR7600 Automated X-ray Inspection (AXI) test system at Globaltronics Singapore from September 9-12, 2008.

http://www.emsnow.com/npps/story.cfm?pg=story&id=35764

Asymtek Wins 2008 Global Technology Award for Spectrum S-920N

www.globalsmt.net | Aug 28, 2008

Global SMT & Packaging magazine, Asymtek Wins 2008 Global Technology Award for Spectrum S-920N

http://www.globalsmt.net/content/view/4720/122/

Simultaneous Acoustic Imaging and Surface Mapping

circuitsassembly.com | Aug 1, 2008

Plastic-encapsulated microcircuit (PEM) warping is of interest to manufacturers for several reasons. First, component warping may create internal stresses that, if eventually released, may result in electrical failure. For example, warping eventually may cause the silicon die to crack.

http://circuitsassembly.com/cms/content/view/6952/95

Sponsored Links

Flip Chips guide

Looking to find Flip Chips? See our Flip Chips guide.

Motherearthnews.Com

Flip Chips

Flip Chips guide Assisting your web search!

www.planetonline.com

Web Sites

Total : 335 View more »

Welcome to Vestal Electronic Devices LLC

Tape and Reel, Axial, Radial, Surface Mount, Odd-Form, Jumper Wires, Ammo Pack, Bandoliering, Custom Wire Forming, Component Packaging, Lead Trim and Form, Supplies, Axial to Radial Conversion, Through Hole to Surface Mount Conversion, Automatic Insertion Equipment, SMC Placement Systems, Detaping,

http://www.vestalelectronics.com/

EDA Tools and IP Cores - Electronics Design, Strategy, News | EDNAsia.com

www.ednasia.com

News and information on software and tools for design and automation, as well as comprehensive coverage of the challenges IC designers face, the most significant technologies produced by providers of EDA (electronic design automation) tools and IP (intellectual property) cores, and the design

http://www.ednasia.com/technical-8-33-edatoolsandipcores-Asia.html

Dummy Components. Genuine TopLine Daisy Chain Lead Free Dummy Components for SMD training, Machine

Dummy Components. Save money the smart way by using TopLine Dummy Components for machine evaluation, solder training, and SMT assembly practice. Lead Free now available. 160 page Catalog. One-stop for all dummy requirements.

http://www.toplinecomponents.com/

T&M/Inspection, Page 4 | EMAsiaMag.com

www.emasiamag.com

In-Circuit Test (ICT), Boundary Scan, Functional Test and other types of automated test equipment (ATE), and also semi-automatic and automatic systems used for the optical and x-ray inspection of printed circuit assemblies.

http://www.emasiamag.com/technical-15-4-solderingequipment-Asia.html

 

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