"Now that Qualcomm, the world's leading fabless integrated circuit provider, has joined the 3D integration program, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."

According to the companies, IMEC's 3D integration program explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find solutions for the use of 3D interconnects at different levels of the wiring hierarchy.

"Three-dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."

Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.

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"We are pleased to welcome Qualcomm to our governing board in support of our mission to foster innovation and a technology-neutral market environment for mobile broadcasting," said Professor Dr. Claus Sattler, executive director of bmcoforum. "Qualcomm brings global experience to our board through their launch of commercial mobile broadcast services in the United States and successful trials in international markets, which supports our global approach for mobile broadcast convergence."

bmcoforum's governing board is comprised of 14 representatives elected by the group's 110 member organizations from the telecommunications, broadcast and content industries. In its new board role, Qualcomm will help guide the bmcoforum as it promotes an open market approach to mobile broadcast services. The Forum's aim is to accelerate the commercial implementation of new user experiences for receiving broadcast services on mobile devices through activities such as promoting technology standardization and lobbying for spectrum and suitable regulatory frameworks.

"The content, broadcast and telecommunications industries are converging through mobile broadcast technologies, and we are committed to helping further the bmcoforum's efforts to accelerate adoption of these technologies through an open market approach," said Chem Assayag, senior director of business development, EMEA for Qualcomm MediaFLO Technologies. "Consumers want broadcast services that feature a variety of content underpinned by an exceptional user experience, which places technologies such as MediaFLO at the heart of this convergence. We look forward to sharing our global insights with the bmcoforum member companies."

Qualcomm Incorporated (http://www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2008 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

Qualcomm Contact:
    Richard Tinkler, Qualcomm Europe
    Phone: +44-7720-060619
    Email: rtinkler@qualcomm.com

    Tina Asmar, Corporate Communications
    Phone: +1-858-845-5959
    Email: corpcomm@qualcomm.com

    John Gilbert, Investor Relations
    Phone: +1-858-658-4813
    Email: ir@qualcomm.com

Web site: http://www.qualcomm.com

Richard Tinkler, Qualcomm Europe, +44-7720-060619, rtinkler@qualcomm.com, or
Tina Asmar, Corporate Communications, +1-858-845-5959, corpcomm@qualcomm.com, or
John Gilbert, Investor Relations, +1-858-658-4813, ir@qualcomm.com, all of
Qualcomm Incorporated

Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

    Qualcomm Contact:
    John Gilbert
    Vice President of Investor and Industry Analyst Relations
    1-858-658-4813 (ph) 1-858-651-9303 (fax)
    ir@qualcomm.com (email)

SOURCE Qualcomm Incorporated

http://www.qualcomm.com

In support of the effort, Cheng Uei Precision Industry (Foxlink) has created a new business unit to support the production of Qualcomm MEMS Technologies' mirasol displays.

Jim Cathey, vice president of business development for Qualcomm MEMS Technologies, said: "Foxlink has decades of experience in delivering quality, timely products for global brand leaders. They are an ideal company with which to collaborate in delivering on the promise of mirasol's low-power, highly reflective displays."

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