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Intel CTO Says Gap between Humans, Machines will Close by 2050
Discover the latest news, press releases, corporate information from Intel Corporation.
News and Blogs

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Intel Talks Up Our Wire-Free, Robot-Ruled Future
www.technewsworld.com | Aug 22, 2008
The most important technology news, developments and trends with insightful analysis and commentary. Coverage includes hardware, software, networking, wireless computing, personal technology, security and cutting-edge technology from the business world to the consumer world.
Intel CTO says gap between humans and machines will close by 2050
www.digitimes.com | Aug 22, 2008
Justin Rattner, Intel's chief technology officer during his keynote today at the Intel Developer Forum in San Francisco, predicted big changes are ahead in social interactions, robotics and improvements in computer's ability to sense the real world. He said Intel's research labs are already looking
Intel imagines wireless power for your laptop
www.tgdaily.com | Aug 21, 2008
lectric Motorcycle inventor crashes at NextFest KillaCycle electric motorcycle inventor almost killed himself at the Wired NextFest conference. >> See all TG Daily videos
RFMD Adds Microwave and Millimeter Wave Components to Portfolio
www.tmcnet.com | Apr 21, 2008
(Wireless News Via Thomson Dialog NewsEdge) RF Micro Devices, a company in the design and manufacture of high-performance radio systems and solutions, announced the expansion of its RF product portfolio to include microwave and millimeter wave components.
Web Sites

Total : 176 View more »
Silicon R&D Pipeline
As feature sizes become smaller and circuits operate at higher speeds, the challenges of delivering more powerful and power-efficient processors increase.
Besser Associates Courses for NEW Courses Training
Very often, simple pre-compliance measurements and techniques can identify issues early when the cost of implementation is substantially lower and design improvements may be made with less impact on schedules.
NEC European Portal - Produkte
NEC is responsible for Internet solutions business in enterprise and consumer markets. These solutions cover supercomputers, computers, PCs, printers, solutions, e-business, ISPs, AFIS, etc.
EV Group - Applications
New advanced chip packaging technologies such as wafer bumping, 3D interconnect and chip scale packaging aim to simplify production steps and package the IC at wafer level using a batch process to decrease the cost of packaging.
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