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Summit Publishing unveils Greener Package
News | www.packworld.com | Jul 22, 2008
Packaging World magazine, announces the development of a new Website and awards competition. GreenerPackage.com will offer tools and resources for materials suppliers, package design and development professionals and packagers who strive to make environmentally responsible business decisions.
Leland Teschler's Editorial: Mass-Transit Myths
News | machinedesign.com | Jul 22, 2008
Regular readers of our letters column may have noticed a discussion about people movers and mass transit.
F/f/s machine
News | www.packagingdigest.com | Jul 18, 2008
The Model RH 250 horizontal f/f/s machine features multiple-axis, servo-driven, rotary heat-sealing dies either in intermittent or continuous motion. It is designed to produce four-sided sealed pouches in a single or multiples of twelve across the 25-in. die face. The co.
Automate and manage customer requirements
News | www.mmh.com | Jul 15, 2008
Here are a few examples of how automated materials handling equipment and technology systems can work together to automate and manage some of the most common customer requirements.
Manufacturing Trends Drive New Microsoft Vision
News | www.automationworld.com | Jul 14, 2008
These trends, as well as a redefined vision for Microsoft s role in manufacturing, were set to be laid out as part of the annual Microsoft Worldwide Partner Conference July 7-10 in Houston. More than 7,000 were expected to attend the event.
Packaging Automation hire solution at Heaven Made
News | www.processingtalk.com | Jul 14, 2008
The ability to respond quickly to the needs of leading retailers is key for UK food manufacturers, and being able to rely on equipment manufacturers to help is vital
Belden, Ferraz Shawmut expand; Leviton in control
News | www.controleng.com | Jul 11, 2008
Belden combined European business units including Hirschmann; Ferraz Shawmut parent acquires majority stake in Zhejiang Mingrong Electrical Protection; and Leviton Manufacturing Co. Inc. buys controlling share of itself from Thomas & Betts Corp. for approximately $300 million.
Chip Scale Package allows RF chip micro-miniaturization.
News | news.thomasnet.com | Jul 10, 2008
Avago Technologies Announces RF Packaging Breakthrough with Innovative WaferCap Chip Scale Technology, Avago Technologies
The "Skies" The Limit For Packaging Automation Service Team
News | www.packagingessentials.com | Jul 9, 2008
Packaging & Converting Essentials: Packaging, graphical and converting industry news and industry related product and services directory
http://www.packagingessentials.com/eqnews.asp?id=2008-07-09-19.35.11.000000
Elau to boost worldwide packaging activities
News | www.ceepackaging.com | Jul 9, 2008
In future ELAU will be the Packaging competence centre of Schneider Electric. Combined with a more intensive use of the group’s infrastructures, this strengthening of ELAU’s position is designed to accelerate the evolution into a global market leader for the automation of packaging machines.
http://www.ceepackaging.com/2008/07/09/elau-to-boost-worldwide-packaging-activities/
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